Search Results - "DRYER PAUL WILLIAM" :: K.UTB vyhledávací portál

Microfluidic cartridge comprising silicone pressure-sensitive adhesive

by Nwachukwu, Chisomaga Ugochi, Hollingshead, Judith Ann, Dryer, Paul William, Weaver, Sean Terrence, Graham, David Christopher
Year of Publication 26.03.2024

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MICROFLUIDIC CARTRIDGE COMPRISING SILICONE PRESSURE-SENSITIVE ADHESIVE

by GRAHAM, David, Christopher, HOLLINGSHEAD, Judith, Ann, DRYER, Paul, William, NWACHUKWU, Chisomaga, Ugochi, WEAVER, Sean, Terrence
Year of Publication 05.07.2023

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MICROFLUIDIC CARTRIDGE COMPRISING SILICONE PRESSURE-SENSITIVE ADHESIVE

by GRAHAM, David, Christopher, HOLLINGSHEAD, Judith, Ann, DRYER, Paul, William, NWACHUKWU, Chisomaga, Ugochi, WEAVER, Sean, Terrence
Year of Publication 25.05.2022

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MICROFLUIDIC CARTRIDGE COMPRISING SILICONE PRESSURE-SENSITIVE ADHESIVE

by NWACHUKWU, Chisomaga Ugochi, GRAHAM, David Christopher, DRYER, Paul William, WEAVER, Sean Terrence, HOLLINGSHEAD, Judith Ann
Year of Publication 21.01.2021

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FORMULATION FOR SILICON-DOPED INK USED TO PREVENT CHIP ETCHING

by HONG, Eunki, DRYER, Paul, William, GUAN, Yimin, SACOTO AGUILAR, Jose, Paul, MONEY, Christopher, John
Year of Publication 22.07.2020

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Method for making a substantially planar micro-fluid ejection head

by MCNEES ANDREW LEE, DRYER PAUL WILLIAM, BERNARD DAVID LAURIER
Year of Publication 09.09.2014

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Formulation for silicon-doped ink used to prevent chip etching

by GUAN YIMIN, DRYER PAUL WILLIAM, HONG EUNKI, SACOTO AGUILAR JOSE PAUL, MONEY CHRISTOPHER JOHN
Year of Publication 29.04.2015

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FORMULATION FOR SILICON-DOPED INK USED TO PREVENT CHIP ETCHING

by SACOTO AGUILAR, JOSE, PAUL, DRYER, PAUL, WILLIAM, MONEY, CHRISTOPHER, JOHN, GUAN, YIMIN, HONG, EUNKI
Year of Publication 08.04.2015

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Micro-fluid ejection heads and methods for bonding substrates to supports

by MCNEES ANDREW LEE, DRYER PAUL WILLIAM, BERNARD DAVID LAURIER
Year of Publication 04.12.2012

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Micro-fluid ejection heads and methods for bonding substrates to supports

by Bernard, David Laurier, Dryer, Paul William, McNees, Andrew Lee
Year of Publication 04.12.2012

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Formulation for silicon-doped ink used to prevent chip etching

by GUAN YIMIN, DRYER PAUL WILLIAM, HONG EUNKI, SACOTO AGUILAR JOSE PAUL, MONEY CHRISTOPHER JOHN
Year of Publication 17.02.2015

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Modular micro-fluid ejection head assembly

by KING DAVID GOLMAN, MCNEES ANDREW LEE, DRYER PAUL WILLIAM, STRUNK TIMOTHY LOWELL, BERNARD DAVID LAURIER
Year of Publication 11.11.2014

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Methods for planarizing unevenness on surface of wafer photoresist layer and wafers produced by the methods

by MCNEES ANDREW LEE, DRYER PAUL WILLIAM, BERNARD DAVID LAURIER
Year of Publication 06.12.2011

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Methods for planarizing unevenness on surface of wafer photoresist layer and wafers produced by the methods

by Bernard, David Laurier, Dryer, Paul William, McNees, Andrew Lee
Year of Publication 06.12.2011

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FORMULATION FOR SILICON-DOPED INK USED TO PREVENT CHIP ETCHING

by SACOTO AGUILAR, JOSE, PAUL, DRYER, PAUL, WILLIAM, MONEY, CHRISTOPHER, JOHN, GUAN, YIMIN, HONG, EUNKI
Year of Publication 03.04.2014

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FORMULATION FOR SILICON-DOPED INK USED TO PREVENT CHIP ETCHING

by SACOTO AGUILAR, JOSE, PAUL, DRYER, PAUL, WILLIAM, MONEY, CHRISTOPHER, JOHN, GUAN, YIMIN, HONG, EUNKI
Year of Publication 30.01.2014

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FORMULATION FOR SILICON-DOPED INK USED TO PREVENT CHIP ETCHING

by GUAN YIMIN, DRYER PAUL WILLIAM, HONG EUNKI, SACOTO AGUILAR JOSE PAUL, MONEY CHRISTOPHER JOHN
Year of Publication 30.01.2014

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Micro-fluid ejection heads and methods for bonding substrates to supports

by MCNEES ANDREW LEE, DRYER PAUL WILLIAM, BERNARD DAVID LAURIER
Year of Publication 19.10.2010

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Micro-fluid ejection heads and methods for bonding substrates to supports

by Bernard, David Laurier, Dryer, Paul William, McNees, Andrew Lee
Year of Publication 19.10.2010

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MICRO-FLUID EJECTION HEADS AND METHODS FOR BONDING SUBSTRATES TO SUPPORTS

by MCNEES ANDREW LEE, DRYER PAUL WILLIAM, BERNARD DAVID LAURIER
Year of Publication 16.09.2010

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