Packaging design challenges of the IBM System z10 Enterprise Class server
Winkel, T-M, Harrer, H, Kaller, D, Supper, J, Dreps, D M, Christian, K L, Cosmadelis, D, Zhou, T, Strach, T, Ludwig, J, Edwards, D L
Published in IBM journal of research and development (01.01.2009)
Published in IBM journal of research and development (01.01.2009)
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Journal Article
Redundant clock switch
Strom, James, Dreps, Daniel M, Rudolph, Bruce George, Wiedemeier, Glen A, Paschal, Matthew James
Year of Publication 03.10.2023
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Year of Publication 03.10.2023
Patent
Adjustable phase shifter
Marquart, Chad Andrew, Dreps, Daniel M, You, Yang, Wiedemeier, Glen A, Bohlke, Tyler
Year of Publication 14.03.2023
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Year of Publication 14.03.2023
Patent
REDUNDANT CLOCK SWITCH
Strom, James, Dreps, Daniel M, Rudolph, Bruce George, Wiedemeier, Glen A, Paschal, Matthew James
Year of Publication 02.02.2023
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Year of Publication 02.02.2023
Patent
High-speed interconnect and packaging design of the IBM System z9 processor cage
Harrer, H., Dreps, D. M., Winkel, T.-M., Scholz, W., Truong, B. G., Huber, A., Zhou, T., Christian, K. L., Goth, G. F.
Published in IBM journal of research and development (01.01.2007)
Published in IBM journal of research and development (01.01.2007)
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Journal Article
ADJUSTABLE PHASE SHIFTER
BOHLKE, Tyler, WIEDEMEIER, Glen A, DREPS, Daniel M, MARQUART, Chad Andrew, YOU, Yang
Year of Publication 24.11.2022
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Year of Publication 24.11.2022
Patent
A Comprehensive Signal Integrity Study of Differential Pairs Routed within a PCB Via Field
Tang, Junyan, Hejase, Jose A., RoyPaladhi, Pavel, Beckir, Wiren D., Dreps, Daniel M.
Published in 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2018)
Published in 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2018)
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Conference Proceeding
3D Electromagnetic Modelling of Connector to PCB Via Transitions
Zhang, Yanyan, Hejase, Jose A., Myers, Joshua C., Audet, Jean J., Becker, Wiren D., Dreps, Daniel M.
Published in 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2018)
Published in 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2018)
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Conference Proceeding
A hybrid land grid array socket connector design for achieving higher signalling data rates
Hejase, Jose A., Chun, Sungjun, Becker, Wiren D., Dreps, Daniel M., Beaman, Brian S.
Published in 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2017)
Published in 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2017)
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Conference Proceeding
Embeded filtering in PCB integrated ultra high speed dielectric waveguides using photonic band gap structures
Myers, Joshua C., Hejase, Jose A., Tang, Junyan, Dreps, Daniel M.
Published in 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2017)
Published in 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2017)
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Conference Proceeding