An approach of numerical multi-objective optimization in stacked packaging : Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems (EuroSimE 2007)
DOWHAN, Lukasz, WYMYSLOWSKI, Artur, DUDEK, Rainer
Published in Microelectronics and reliability (2008)
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Published in Microelectronics and reliability (2008)
Journal Article
Numerical prototyping methods in microsystem accelerometers design
Dowhań, Łukasz, Wymysłowski, Artur, Kaliciński, Stanisław, Janus, Paweł
Published in Microelectronics and reliability (01.07.2011)
Published in Microelectronics and reliability (01.07.2011)
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Journal Article
Conference Proceeding
Extraction of elastic–plastic material properties of thin films through nanoindentaion technique with support of numerical methods
Dowhań, Łukasz, Wymysłowski, Artur, Janus, Paweł, Ekwińska, Magdalena, Wittler, Olaf
Published in Microelectronics and reliability (01.06.2011)
Published in Microelectronics and reliability (01.06.2011)
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Journal Article
An approach of numerical multi-objective optimization in stacked packaging
Dowhań, Łukasz, Wymysłowski, Artur, Dudek, Rainer
Published in Microelectronics and reliability (01.06.2008)
Published in Microelectronics and reliability (01.06.2008)
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Journal Article
Extraction of elastic-plastic material properties of thin films through nanoindentaion technique with support of numerical methods : THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS (EUROSIME 2010)
DOWHAN, Łukasz, WYMYSŁOWSKI, Artur, JANUS, Paweł, EKWINSKA, Magdalena, WITTLER, Olaf
Published in Microelectronics and reliability (2011)
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Published in Microelectronics and reliability (2011)
Journal Article
Simulated annealing as a global optimization algorithm used in numerical prototyping of electronic packaging
Dowhan, Lukasz, Wymyslowski, Artur, Urbanski, Krzysztof
Published in EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2009)
Published in EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2009)
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Conference Proceeding
Numerical approach to extraction of elasto-plastic material models and corresponding properties of thin layers through nanoindentation technique
Wymyslowski, Artur, Wittler, O., Mrossko, R., Dudek, Rainer, Auersperg, Juergen, Dowhan, Lukasz
Published in EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2009)
Published in EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2009)
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Conference Proceeding
Application of numerical optimization algorithms used to investigation of thin films in nanoindentation test
Dowhan, Lukasz, Wymyslowski, Artur, Wittler, Olaf, Mrossko, Raul
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
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Conference Proceeding
Application of multi-criteria optimization algorithms to numerical material extraction of thin layers through nanoindentaion technique
Dowhan, Lukasz, Wymyslowski, Artur, Janus, Pawel, Ekwinska, Magdalena, Wittler, Olaf
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)
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Conference Proceeding
Parametric Approach to Numerical Design for Optimization of Stacked Packages
Dowhan, Lukasz, Wymyslowski, Artur, Dudek, Rainer, Auersperg, Jurgen
Published in 2006 1st Electronic Systemintegration Technology Conference (01.09.2006)
Published in 2006 1st Electronic Systemintegration Technology Conference (01.09.2006)
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Conference Proceeding
Application of genetic algorithm in numerical multi-objective optimization of ceramic capacitors
Dowhan, L., Wymyslowski, A., Felba, J., Wiese, S., Wolter, K.-J.
Published in 2008 2nd Electronics System-Integration Technology Conference (01.09.2008)
Published in 2008 2nd Electronics System-Integration Technology Conference (01.09.2008)
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Conference Proceeding
Investigation of thin films by nanoindentation with doe and numerical methods
Dowhan, L, Wymyslowski, A, Wittler, O
Published in 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2011)
Published in 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2011)
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Conference Proceeding
The polymer materials as the essential input parameters in numerical multi-objective optimization of stacked packaging
Dowhan, L., Wymyslowski, A., Felba, J., Dudek, R.
Published in PORTABLE-POLYTRONIC 2008 - 2nd IEEE International Interdisciplinary Conference on Portable Information Devices and the 2008 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics (01.08.2008)
Published in PORTABLE-POLYTRONIC 2008 - 2nd IEEE International Interdisciplinary Conference on Portable Information Devices and the 2008 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics (01.08.2008)
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Conference Proceeding
Multi-objective Parametric Approach to Numerical Optimization of Stacked Packages
Dowhan, L., Wymyslowski, A., Dudek, R.
Published in 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 (01.04.2007)
Published in 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 (01.04.2007)
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Conference Proceeding