An enlarged process window for hot embossing
Yao, Donggang, Kuduva-Raman-Thanumoorthy, Ramasubramani
Published in Journal of micromechanics and microengineering (01.04.2008)
Published in Journal of micromechanics and microengineering (01.04.2008)
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Journal Article
Hot embossing of discrete microparts
Kuduva-Raman-Thanumoorthy, Ramasubramani, Yao, Donggang
Published in Polymer engineering and science (01.10.2009)
Published in Polymer engineering and science (01.10.2009)
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Journal Article
Fusion bonding of supercooled poly(ethylene terephthalate) between Tg and Tm
Li, Ruihua, Yao, Donggang, Sun, Qunhui, Deng, Yulin
Published in Journal of applied polymer science (05.03.2011)
Published in Journal of applied polymer science (05.03.2011)
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Journal Article
Study on squeezing flow during nonisothermal embossing of polymer microstructures
Yao, Donggang, Virupaksha, Vinayshankar L., Kim, Byung
Published in Polymer engineering and science (01.05.2005)
Published in Polymer engineering and science (01.05.2005)
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Journal Article
Processing of viscoelastic data via a generalized fractional model
Su, Xianglong, Yao, Donggang, Xu, Wenxiang
Published in International journal of engineering science (01.04.2021)
Published in International journal of engineering science (01.04.2021)
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Journal Article
A new method for formulating linear viscoelastic models
Su, Xianglong, Yao, Donggang, Xu, Wenxiang
Published in International journal of engineering science (01.11.2020)
Published in International journal of engineering science (01.11.2020)
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Journal Article