Search Results - "DITZEL ECKHARD" :: K.UTB vyhledávací portál

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접속 캐리어, 광전자 부품 및 접속 캐리어 또는 광전자 부품의 제조 방법

by KLAJIC TIHOMIR, BIEBERSDORF ANDREAS, DITZEL ECKHARD, WINDISCH REINER
Year of Publication 02.11.2018

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연결 캐리어를 제조하기 위한 방법, 연결 캐리어 및 연결 캐리어를 구비한 광전자 반도체 컴포넌트

by PEETSCH ALEXANDER, BENEDIKT MICHAEL, DITZEL ECKHARD, SORG JOERG ERICH, ZIEGLER STEFAN, AUSTGEN MICHAEL
Year of Publication 05.03.2018

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OPTOELECTRONIC COMPONENT

by ZITZLSPERGER MICHAEL, DITZEL ECKHARD, SORG JOERG ERICH
Year of Publication 13.09.2012

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CHIP-INTEGRATED THROUGH-PLATING OF MULTILAYER SUBSTRATES

by KLEIN ANDREAS, KRUEGER FRANK, DITZEL ECKHARD, SCHUMANN MICHAEL
Year of Publication 30.07.2013

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LAMINATE COMPRISING AN INTEGRATED ELECTRONIC COMPONENT

by KOCK WULF, KLEIN ANDREAS, KRUEGER FRANK, HINRICH ANDREAS, DITZEL ECKHARD
Year of Publication 10.07.2013

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OPTOELECTRONIC COMPONENT

by DITZEL, ECKHARD, ZITZLSPERGER, MICHAEL, SORG, JORG ERICH
Year of Publication 09.11.2020

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Strip-type substrate for producing chip card modules

by Gehlert, Bernd, Krüger, Frank, Ditzel, Eckhard
Year of Publication 08.01.2019

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SUBSTRATE WITH ENLARGED CHIP ISLAND

by DITZEL, ECKHARD, WALTER, SIEGFRIED
Year of Publication 24.11.2014

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STRIP-SHAPED SUBSTRATE FOR PRODUCING CHIP CARRIERS, ELECTRONIC MODULE WITH A CHIP CARRIER OF THIS TYPE, ELECTRONIC DEVICE WITH A MODULE OF THIS TYPE, AND METHOD FOR PRODUCING A SUBSTRATE

by WALTER, Siegfried, BECKER, Udo, BENEDIKT, Michael, DITZEL, Eckhard
Year of Publication 22.01.2020

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STRIP-TYPE SUBSTRATE FOR PRODUCING CHIP CARD MODULES

by GEHLERT Bernd, KRÜGER Frank, DITZEL Eckhard
Year of Publication 08.02.2018

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STRIP-TYPE SUBSTRATE FOR PRODUCING CHIP CARD MODULES

by DITZEL, Eckhard, GEHLERT, Bernd, KRÜGER, Frank
Year of Publication 27.12.2017

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Connection Carrier, Optoelectronic Component and Method for Producing a Connection Carrier or an Optoelectronic Component

by Biebersdorf, Andreas, Ditzel, Eckhard, Klajic, Tihomir, Windisch, Reiner
Year of Publication 28.03.2019

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LEAD FRAME STRIP FOR ELECTRONIC COMPONENTS

by ECKHARD DITZEL, MICHAEL BENEDIKT, REINHARD DITZEL
Year of Publication 28.02.2017

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Anschlussträger, optoelektronisches Bauteil und Verfahren zur Herstellung eines Anschlussträgers oder eine optoelektronischen Bauteils

by Biebersdorf, Andreas, Ditzel, Eckhard, Klajic, Tihomir, Windisch, Reiner
Year of Publication 22.11.2018

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OPTOELECTRONIC COMPONENT

by DITZEL, ECKHARD, ZITZLSPERGER, MICHAEL, SORG, JÖRG, ERICH
Year of Publication 27.07.2016

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Strip-shaped substrate for producing chip carriers, electronic module with a chip carrier of this type, electronic device with a module of this type, and method for producing a substrate

by Benedikt Michael, Ditzel Eckhard, Becker Udo, Walter Siegfried
Year of Publication 10.04.2018

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Method of producing a connection support, connection support and optoelectronic semiconductor component comprising a connection support

by Benedikt, Michael, Sorg, Jörg Erich, Ziegler, Stefan, Peetsch, Alexander, Austgen, Michael, Ditzel, Eckhard
Year of Publication 05.11.2019

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Chip-integrated through-plating of multi-layer substrates

by Schumann Michael, Klein Andreas Steffen, Krüger Frank, Ditzel Eckhard
Year of Publication 05.09.2017

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Substrat mit vergrößerter Chipinsel und Verfahren zu dessen Herstellung

by Walter, Siegfried, Ditzel, Eckhard
Year of Publication 22.06.2017

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Optoelectronic component

by ZITZLSPERGER MICHAEL, DITZEL ECKHARD, SORG JÖRG ERICH
Year of Publication 02.06.2015

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