Semiconductor die packages using thin dies and metal substrates
Yilmaz, Hamza, Sapp, Steven, Wang, Qi, Li, Minhua, Murphy, James J, Diroll, John Robert
Year of Publication 11.12.2012
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Year of Publication 11.12.2012
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SEMICONDUCTOR DIE PACKAGES USING THIN DIES AND METAL SUBSTRATE
SAPP, STEVEN, LI, MINHUA, DIROLL, JOHN ROBERT, YILMAZ, HAMZA, MURPHY, JAMES J, WANG, QI
Year of Publication 15.03.2013
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Year of Publication 15.03.2013
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Semiconductor die packages using thin dies and metal substrates
LI MINHUA, MURPHY JAMES J, YILMAZ HAMZA, SAPP STEVEN, WANG QI, DIROLL JOHN ROBERT
Year of Publication 11.12.2012
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Year of Publication 11.12.2012
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Semiconductor die packages using thin dies and metal substrates
Yilmaz, Hamza, Sapp, Steven, Wang, Qi, Li, Minhua, Murphy, James J, Diroll, John Robert
Year of Publication 03.08.2010
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Year of Publication 03.08.2010
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SEMICONDUCTOR DIE PACKAGES USING THIN DIES AND METAL SUBSTRATES
LI MINHUA, MURPHY JAMES J, YILMAZ HAMZA, SAPP STEVEN, WANG QI, DIROLL JOHN ROBERT
Year of Publication 21.10.2010
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Year of Publication 21.10.2010
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Semiconductor die packages using thin dies and metal substrates
LI MINHUA, MURPHY JAMES J, YILMAZ HAMZA, SAPP STEVEN, WANG QI, DIROLL JOHN ROBERT
Year of Publication 03.08.2010
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Year of Publication 03.08.2010
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Dünne Plättchen und Metallsubstrate verwendende Halbleiterplättchengehäuse
SAPP, STEVEN, LI, MINHUA, DIROLL, JOHN ROBERT, YILMAZ, HAMZA, MURPHY, JAMES J, WANG, QI
Year of Publication 09.04.2009
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Year of Publication 09.04.2009
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SEMICONDUCTOR DIE PACKAGES USING THIN DIES AND METAL SUBSTRATES
LI MINHUA, MURPHY JAMES J, YILMAZ HAMZA, SAPP STEVEN, WANG QI, DIROLL JOHN ROBERT
Year of Publication 19.02.2009
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Year of Publication 19.02.2009
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SEMICONDUCTOR DIE PACKAGES USING THIN DIES AND METAL SUBSTRATES
SAPP, STEVEN, LI, MINHUA, DIROLL, JOHN ROBERT, YILMAZ, HAMZA, WANG, QI, MURPHY, JAMES, J
Year of Publication 17.04.2008
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Year of Publication 17.04.2008
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SEMICONDUCTOR DIE PACKAGES USING THIN DIES AND METAL SUBSTRATES
SAPP, STEVEN, LI, MINHUA, DIROLL, JOHN ROBERT, YILMAZ, HAMZA, WANG, QI, MURPHY, JAMES, J
Year of Publication 18.10.2007
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Year of Publication 18.10.2007
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Semiconductor die packages using thin dies and metal substrates
SAPP, STEVEN, LI, MINHUA, DIROLL, JOHN ROBERT, YILMAZ, HAMZA, MURPHY, JAMES J, WANG, QI
Year of Publication 01.06.2014
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Year of Publication 01.06.2014
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Semiconductor die packages using thin dies and metal substrates
SAPP, STEVEN, LI, MINHUA, DIROLL, JOHN ROBERT, YILMAZ, HAMZA, MURPHY, JAMES J, WANG, QI
Year of Publication 01.01.2008
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Year of Publication 01.01.2008
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