Copper Direct-Bonding Characterization and Its Interests for 3D Integration
Gueguen, Pierric, Di Cioccio, Léa, Gergaud, Patrice, Rivoire, Maurice, Scevola, Daniel, Zussy, Marc, Charvet, Anne Marie, Bally, Laurent, Lafond, Dominique, Clavelier, Laurent
Published in Journal of the Electrochemical Society (2009)
Published in Journal of the Electrochemical Society (2009)
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Comparative life cycle assessment of hybrid bonding and copper pillar die-to-wafer 3D integrations for sub-THz applications
Roulleau, Lea, Vauche, Laura, Valorge, Olivier, Dubarry, Christophe, Cioccio, Lea Di
Published in 2023 18th European Microwave Integrated Circuits Conference (EuMIC) (18.09.2023)
Published in 2023 18th European Microwave Integrated Circuits Conference (EuMIC) (18.09.2023)
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Conference Proceeding
Cradle-to-Gate Life Cycle Assessment (LCA) of GaN Power Semiconductor Device
Vauche, Laura, Guillemaud, Gabin, Lopes Barbosa, Joao-Carlos, Di Cioccio, Léa
Published in Global sustainability (01.01.2024)
Published in Global sustainability (01.01.2024)
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Direct bonding for wafer level 3D integration
Di Cioccio, Lea, Radu, Ionut, Gueguen, Pierric, Sadaka, Mariam
Published in 2010 IEEE International Conference on Integrated Circuit Design and Technology (01.06.2010)
Published in 2010 IEEE International Conference on Integrated Circuit Design and Technology (01.06.2010)
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Conference Proceeding
A Compact SOI-Integrated Multiwavelength Laser Source Based on Cascaded InP Microdisks
Van Campenhout, J., Liu Liu, Romeo, P.R., Van Thourhout, D., Seassal, C., Regreny, P., Di Cioccio, L., Fedeli, J.-M., Baets, R.
Published in IEEE photonics technology letters (15.08.2008)
Published in IEEE photonics technology letters (15.08.2008)
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Journal Article
Physics of direct bonding: Applications to 3D heterogeneous or monolithic integration
Gueguen, Pierric, Ventosa, Caroline, Cioccio, Léa Di, Moriceau, Hubert, Grossi, François, Rivoire, Maurice, Leduc, Patrick, Clavelier, Laurent
Published in Microelectronic engineering (01.03.2010)
Published in Microelectronic engineering (01.03.2010)
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Conference Proceeding
Design and Optimization of Electrically Injected InP-Based Microdisk Lasers Integrated on and Coupled to a SOI Waveguide Circuit
Van Campenhout, J., Romeo, P.R., Van Thourhout, D., Seassal, C., Regreny, P., Di Cioccio, L., Fedeli, J.-M., Baets, R.
Published in Journal of lightwave technology (01.01.2008)
Published in Journal of lightwave technology (01.01.2008)
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Conference Proceeding
3-D Capacitive Interconnections for Wafer-Level and Die-Level Assembly
Fazzi, A., Magagni, L., Mirandola, M., Charlet, B., Di Cioccio, L., Jung, E., Canegallo, R., Guerrieri, R.
Published in IEEE journal of solid-state circuits (01.10.2007)
Published in IEEE journal of solid-state circuits (01.10.2007)
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Conference Proceeding
Full characterization of Cu/Cu direct bonding for 3D integration
Taibi, Rachid, Di Cioccio, Léa, Chappaz, Cedrick, Chapelon, Laurent-Luc, Gueguen, Pierric, Dechamp, Jérome, Fortunier, Roland, Clavelier, Laurent
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
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Conference Proceeding
Comparative Life Cycle Analysis of Redistribution Layer for 3D Integrations
Guillou, Suzanne, Saint-Patrice, Damien, Vauche, Laura, Castagne, Laetitia, Moreau, Stephane, Velard, Remi, Di Cioccio, Lea
Published in 2024 Electronics Goes Green 2024+ (EGG) (18.06.2024)
Published in 2024 Electronics Goes Green 2024+ (EGG) (18.06.2024)
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Conference Proceeding
Silicon Die Self-alignment on a Wafer: Stable and Unstable Modes
Berthier, Jean, Brakke, Kenneth, Grossi, François, Sanchez, Lo¨c, Di Cioccio, Léa
Published in Sensors & transducers (01.04.2010)
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Published in Sensors & transducers (01.04.2010)
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Realization of AlGaN/GaN HEMTs on Si-on-polySiC substrates
Cordier, Yvon, Chenot, Sébastien, Laügt, Marguerite, Tottereau, Olivier, Joblot, Sylvain, Semond, Fabrice, Massies, Jean, Di Cioccio, Léa, Moriceau, Hubert
Published in Physica status solidi. C (01.06.2007)
Published in Physica status solidi. C (01.06.2007)
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Journal Article
Low-Footprint Optical Interconnect on an SOI Chip Through Heterogeneous Integration of InP-Based Microdisk Lasers and Microdetectors
Van Campenhout, J., Binetti, P.R.A., Romeo, P.R., Regreny, P., Seassal, C., Leijtens, X.J.M., de Vries, T., Yoki Siang Oei, van Veldhoven, R.P.J., Notzel, R., Di Cioccio, L., Fedeli, J.-M., Smit, M.K., Van Thourhout, D., Baets, R.
Published in IEEE photonics technology letters (15.04.2009)
Published in IEEE photonics technology letters (15.04.2009)
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Journal Article
Chip to wafer copper direct bonding electrical characterization and thermal cycling
Beilliard, Yann, Coudrain, Perceval, Di Cioccio, Lea, Moreau, Stephane, Sanchez, Loic, Montmayeul, Brigitte, Signamarcheix, Thomas, Estevez, Rafael, Parry, Guillaume
Published in 2013 IEEE International 3D Systems Integration Conference (3DIC) (01.10.2013)
Published in 2013 IEEE International 3D Systems Integration Conference (3DIC) (01.10.2013)
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Conference Proceeding
Copper direct bonding for 3D integration
Gueguen, Pierric, di Cioccio, Lea, Rivoire, Maurice, Scevola, Daniel, Zussy, Marc, Charvet, Anne Marie, Bally, Laurent, Lafond, Dominique, Clavelier, Laurent
Published in 2008 International Interconnect Technology Conference (01.06.2008)
Published in 2008 International Interconnect Technology Conference (01.06.2008)
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Conference Proceeding
Copper direct bonding: An innovative 3D interconnect
Gueguen, Pierric, Di Cioccio, Léa, Morfouli, Panagiota, Zussy, Marc, Dechamp, Jérome, Bally, Laurent, Clavelier, Laurent
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
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Conference Proceeding
Milliwatt-level fiber-coupled laser power from photonic crystal band-edge laser
Kim, Sunghwan, Ahn, Sungmo, Lee, Jeongkug, Jeon, Heonsu, Regreny, Philippe, Seassal, Christian, Augendre, Emmanuel, Di Cioccio, Lea
Published in Optics express (31.01.2011)
Published in Optics express (31.01.2011)
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Journal Article
Vertical metal interconnect thanks to tungsten direct bonding
Di Cioccio, Léa, Gueguen, Pierric, Grouiller, Etienne, Vandroux, Laurent, Delaye, Vincent, Rivoire, Maurice, Lugand, Jean François, Clavelier, Laurent
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
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Conference Proceeding