Search Results - "DHANE KEDAR" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

In situ and real-time metrology during rinsing of micro- and nano-structures

In situ and real-time metrology during rinsing of micro- and nano-structures

by Yan, Jun, Dhane, Kedar, Vermeire, Bert, Shadman, Farhang
Published in Microelectronic engineering (01.02.2009)

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Journal Article Conference Proceeding

Surface cleaning of small structures during spin rinsing of patterned substrates

Surface cleaning of small structures during spin rinsing of patterned substrates

by Zamani, Davoud, Dhane, Kedar, Mahdavi, Omid, McBride, Michael Anthony, Yan, Jun, Shadman, Farhang
Published in Microelectronic engineering (01.08.2013)

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Journal Article

Dynamics of Cleaning and Rinsing of Micro and Nano Structures in Single-Wafer Cleaning Tools

Dynamics of Cleaning and Rinsing of Micro and Nano Structures in Single-Wafer Cleaning Tools

by Dhane, Kedar, Jeongnam Han, Jun Yan, Mahdavi, Omid, Zamani, Davoud, Vermeire, Bert, Shadman, Farhang
Published in IEEE transactions on semiconductor manufacturing (01.02.2011)

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Journal Article

ON PACKAGE FLOATING METAL/STIFFENER GROUNDING TO MITIGATE RFI AND SI RISKS

ON PACKAGE FLOATING METAL/STIFFENER GROUNDING TO MITIGATE RFI AND SI RISKS

by CHENEY ROBERT F, RAORANE DIGVIJAY A, JIANG HONGJIN, STARKSTON ROBERT, JONES KEITH D, DHALL ASHISH, STOVER PATRICK N, DHANE KEDAR, WENG LI SHENG, KARHADE OMKAR G, RAMALINGAM SURIYAKALA
Year of Publication 21.09.2016

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Patent

Electronic package that includes multiple supports

Electronic package that includes multiple supports

by Karhade, Omkar, Dhane, Kedar
Year of Publication 29.10.2019

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Patent

ELECTRONIC PACKAGE THAT INCLUDES MULTIPLE SUPPORTS

ELECTRONIC PACKAGE THAT INCLUDES MULTIPLE SUPPORTS

by Karhade, Omkar, Dhane, Kedar
Year of Publication 13.12.2018

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Patent

Liquid thermal interface material in electronic packaging

Liquid thermal interface material in electronic packaging

by Karhade, Omkar, Antoniswamy, Aravindha R, Dhane, Kedar, Mani, Divya
Year of Publication 14.02.2023

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Patent

ELECTRONIC PACKAGE THAT INCLUDES MULTIPLE SUPPORTS

ELECTRONIC PACKAGE THAT INCLUDES MULTIPLE SUPPORTS

by KARHADE, Omkar, DHANE, Kedar
Year of Publication 22.06.2017

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Patent

ELECTRONIC PACKAGE THAT INCLUDES MULTIPLE SUPPORTS

ELECTRONIC PACKAGE THAT INCLUDES MULTIPLE SUPPORTS

by Dhane Kedar, Karhade Omkar
Year of Publication 15.06.2017

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Patent

LIQUID THERMAL INTERFACE MATERIAL IN ELECTRONIC PACKAGING

LIQUID THERMAL INTERFACE MATERIAL IN ELECTRONIC PACKAGING

by Karhade, Omkar, Antoniswamy, Aravindha R, Dhane, Kedar, Mani, Divya
Year of Publication 25.06.2020

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Patent

MAGNETIC MOLD MATERIAL INDUCTORS FOR ELECTRONIC PACKAGES

MAGNETIC MOLD MATERIAL INDUCTORS FOR ELECTRONIC PACKAGES

by Dhane, Kedar, Lambert, William J, Sankarasubramanian, Malavarayan, Min, Yongki
Year of Publication 25.06.2020

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Patent

Plurality of stiffeners with thickness variation

Plurality of stiffeners with thickness variation

by Prstic Suzana, Dhane Kedar, Xu Mingjie
Year of Publication 24.10.2017

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Patent

Thermal interfaces for integrated circuit packages

Thermal interfaces for integrated circuit packages

by Dhane, Kedar, Cetegen, Edvin, Karhade, Omkar G, Jha, Chandra M
Year of Publication 14.05.2019

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Patent

SYSTEMS, METHODS AND DEVICES FOR STIFFENER CONSTRUCTION FOR USE IN PICK AND PLACE MEDIA

SYSTEMS, METHODS AND DEVICES FOR STIFFENER CONSTRUCTION FOR USE IN PICK AND PLACE MEDIA

by Prstic Suzana, Dhane Kedar, Xu Mingjie
Year of Publication 22.06.2017

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Patent

Component stiffener architectures for microelectronic package structures

Component stiffener architectures for microelectronic package structures

by Dhane, Kedar, Lambert, William J, Karhade, Omkar G, Min, Yongki
Year of Publication 18.12.2018

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Patent

ELECTRONIC PACKAGE THAT INCLUDES MULTIPLE SUPPORTS

ELECTRONIC PACKAGE THAT INCLUDES MULTIPLE SUPPORTS

by DHANE KEDAR, KARHADE OMKAR
Year of Publication 31.07.2018

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Patent

COMPONENT STIFFENER ARCHITECTURES FOR MICROELECTRONIC PACKAGE STRUCTURES

COMPONENT STIFFENER ARCHITECTURES FOR MICROELECTRONIC PACKAGE STRUCTURES

by LAMBERT, William J, KARHADE, Omkar G, MIN, Yongki, DHANE, Kedar
Year of Publication 05.07.2018

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Patent

COMPONENT STIFFENER ARCHITECTURES FOR MICROELECTRONIC PACKAGE STRUCTURES

COMPONENT STIFFENER ARCHITECTURES FOR MICROELECTRONIC PACKAGE STRUCTURES

by Dhane, Kedar, Lambert, William J, Karhade, Omkar G, Min, Yongki
Year of Publication 28.06.2018

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Patent

THERMAL INTERFACES FOR INTEGRATED CIRCUIT PACKAGES

THERMAL INTERFACES FOR INTEGRATED CIRCUIT PACKAGES

by CETEGEN, Edvin, KARHADE, Omkar G, JHA, Chandra M, DHANE, Kedar
Year of Publication 05.04.2018

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Patent

THERMAL INTERFACES FOR INTEGRATED CIRCUIT PACKAGES

THERMAL INTERFACES FOR INTEGRATED CIRCUIT PACKAGES

by Cetegen Edvin, Dhane Kedar, Karhade Omkar G, Jha Chandra M
Year of Publication 29.03.2018

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Patent