by Ling Zhang, Wenjian Yu, Yulei Zhang, Renshen Wang, Deutsch, A., Katopis, G. A., Dreps, D. M., Buckwalter, J., Kuh, E. S., Chung-Kuan Cheng
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2011)

by Deutsch, A.
Published in Proceedings of the IEEE (01.02.1998)

by Knickerbocker, J. U., Andry, P. S., Buchwalter, L. P., Deutsch, A., Horton, R. R., Jenkins, K. A., Kwark, Y. H., McVicker, G., Patel, C. S., Polastre, R. J., Schuster, C. D., Sharma, A., Sri-Jayantha, S. M., Surovic, C. W., Tsang, C. K., Webb, B. C., Wright, S. L., McKnight, S. R., Sprogis, E. J., Dang, B.
Published in IBM journal of research and development (01.07.2005)

by Haikun Zhu, Chung-Kuan Cheng, Deutsch, A., Katopis, G.
Published in 2007 IEEE Electrical Performance of Electronic Packaging (01.10.2007)

by Yulei Zhang, Xiang Hu, Deutsch, A., Engin, A. E., Buckwalter, J. F., Chung-Kuan Cheng
Published in IEEE transactions on very large scale integration (VLSI) systems (01.07.2011)

by Deutsch, A., Surovic, C.W., Krabbenhoft, R.S., Kopcsay, G.V., Chamberlin, B.J.
Published in IEEE transactions on advanced packaging (01.05.2007)

by Haikun Zhu, Rui Shi, Hongyu Chen, Chung-Kuan Cheng, Deutsch, A., Katopis, G.
Published in 2006 IEEE Electrical Performane of Electronic Packaging (01.10.2006)

by Ling Zhang, Wenjian Yu, Yulei Zhang, Renshen Wang, Deutsch, A., Katopis, G.A., Dreps, D.M., Buckwalter, J., Kuh, E., Chung-Kuan Cheng
Published in 2008 16th IEEE Symposium on High Performance Interconnects (01.01.2008)

by Deutsch, Alina, Krabbenhoft, Roger S, Melde, Kathleen L, Surovic, Christopher W, Katopis, George A, Kopcsay, Gerard V, Zhen Zhou, Zhaoqing Chen, Kwark, Young H, Winkel, Thomas-Michael, Xiaoxiong Gu, Standaert, Theodorus E
Published in IEEE transactions on electromagnetic compatibility (01.05.2010)

by Deutsch, A., Kopcsay, G.V., Restle, P.J., Smith, H.H., Katopis, G., Becker, W.D., Coteus, P.W., Surovic, C.W., Rubin, B.J., Dunne, R.P., Gallo, T., Jenkins, K.A., Terman, L.M., Dennard, R.H., Sai-Halasz, G.A., Krauter, B.L., Knebel, D.R.
Published in IEEE transactions on microwave theory and techniques (01.10.1997)

by Morsey, J., Deutsch, A., Libous, J.P., Surovic, C., Rubin, B.J., Lijun Jiang, Eisenberg, L.
Published in IEEE transactions on advanced packaging (01.05.2007)

by Deutsch, A., Kopcsay, G.V., Coteus, P.W., Surovic, C.W., Dahlen, P.E., Heckmann, D.L., Dah-Weih Duan
Published in IEEE transactions on electromagnetic compatibility (01.11.2001)

by Kopcsay, G.V., Krauter, B., Widiger, D., Deutsch, A., Rubin, B.J., Smith, H.H.
Published in IEEE transactions on very large scale integration (VLSI) systems (01.12.2002)

by Zhang, Ling, Yu, Wenjian, Zhu, Haikun, Deutsch, Alina, Katopis, George A., Dreps, Daniel M., Kuh, Ernest, Cheng, Chung-Kuan
Published in 2008 45th ACM/IEEE Design Automation Conference (08.06.2008)

by DEUTSCH, Alina, COTEUS, Paul W, KOPCSAY, Gerard V, SMITH, Howard H, SUROVIC, Christopher W, KRAUTER, Byron L, EDELSTEIN, Daniel C, RESTLE, Phillip J
Published in Proceedings of the IEEE (2001)

by DEUTSCH, Alina, KOPCSAY, Gerard V, COTEUS, Paul W, SUROVIC, Christopher W, DAHLEN, Paul E, HECKMANN, David L, DUAN, Dah-Weih
Published in IEEE transactions on electromagnetic compatibility (2001)

by Chuan Xu, Lijun Jiang, Kolluri, S.K., Rubin, B.J., Deutsch, A., Smith, H., Banerjee, K.
Published in 2009 IEEE/ACM International Conference on Computer-Aided Design - Digest of Technical Papers (01.11.2009)

by DEUTSCH, Alina, SWAMINATHAN, Madhavan
Published in IEEE transactions on advanced packaging (1999)

by Widmer, A.X., Wrenner, K., Ainspan, H.A., Parker, B., Austruy, P., Brezzo, B., Haen, A.-M., Ewen, J.F., Soyuer, M., Blanc, A., Abbiate, J.-C., Deutsch, A., Hyun J. Shin
Published in IEEE journal of solid-state circuits (01.12.1996)

by Lijun Jiang, Chuan Xu, Smith, Howard, Rubin, Barry, Deutsch, Alina, Caron, Alain
Published in 2010 Asia-Pacific International Symposium on Electromagnetic Compatibility (01.04.2010)