Efficient modeling methodology and hardware validation of glass-ceramic based wiring for high-performance single- and multi-chip modules
Sungjun Chun, Haridass, A., Deutsch, A., Rubin, B., Surovic, C., Klink, E., O'Connor, D., Hsichang Liu, Spring, C., Winkel, T.-M., Dyckman, W., Katopis, G., Kopcsay, G.
Published in Proceedings Electronic Components and Technology, 2005. ECTC '05 (2005)
Published in Proceedings Electronic Components and Technology, 2005. ECTC '05 (2005)
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Conference Proceeding
Stretching and sensing of 1-µm bubbles in ion-implanted contiguous disk devices
Mazzeo, N., Sanders, I., Kryder, M., Deutsch, A.
Published in IEEE transactions on magnetics (01.11.1979)
Published in IEEE transactions on magnetics (01.11.1979)
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Journal Article
A package analysis tool based on a method of moments surface formulation
Ponnapalli, S., Deutsch, A., Bertin, R.
Published in IEEE transactions on components, hybrids, and manufacturing technology (01.12.1993)
Published in IEEE transactions on components, hybrids, and manufacturing technology (01.12.1993)
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Frequency-dependent crosstalk simulation for on-chip interconnections
Deutsch, A., Smith, H.H., Surovic, C.W., Kopcsay, G.V., Webber, D.A., Coteus, P.W., Katopis, G.A., Becker, W.D., Dansky, A.H., Sai-Halasz, G.A., Restle, P.J.
Published in IEEE transactions on advanced packaging (01.08.1999)
Published in IEEE transactions on advanced packaging (01.08.1999)
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Journal Article
Conference Proceeding
In-line process monitors for thin film wiring
YEH; HELEN L, ZUPICICH; ATILIO, DEUTSCH; ALINA, OPRYSKO; MODEST M, ROTHMAN; LAURA B, RITSKO; JOHN J
Year of Publication 12.06.1990
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Year of Publication 12.06.1990
Patent
Short-pulse propagation technique for characterizing resistive package interconnections
Deutsch, A., Arjavalingam, G., Kopcsay, G.V., Degerstrom, M.J.
Published in IEEE transactions on components, hybrids, and manufacturing technology (01.12.1992)
Published in IEEE transactions on components, hybrids, and manufacturing technology (01.12.1992)
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Conference Proceeding
Electrical characteristics of high-performance pin-in-socket and pad-on-pad connectors
Deutsch, A., Surovic, C.W., Campbell, J.S., Coteus, P.W., Lanzetta, A.P., Holton, J.T., Knight, A.D.
Published in IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging (01.02.1997)
Published in IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging (01.02.1997)
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Journal Article
Magnetic bubble memory exerciser
Deutsch, A., Mackay, J., Kryder, M., Cohen, M., Halperin, A., Stukey, F.
Published in IEEE transactions on magnetics (01.03.1980)
Published in IEEE transactions on magnetics (01.03.1980)
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Journal Article
Measurement of dielectric anisotropy of BPDA-PDA polyimide in multilayer thin-film packages
Deutsch, A., Swaminathan, M., Ree, M.-H., Surovic, C.W., Arjavalingam, G., Prasad, K., McHerron, D.C., McAllister, M., Kopcsay, G.V., Giri, A.P., Perfecto, E., White, G.E.
Published in IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging (01.11.1994)
Published in IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging (01.11.1994)
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Journal Article
Broadband characterization of low dielectric constant and low dielectric loss CYTUF cyanate ester printed circuit board material
Deutsch, A., Surovic, C.W., Lanzetta, A.P., Ainspan, H.A., Abbiate, J.-C., Viehbeck, A., Hedrick, J.C., Shaw, J.M., Tisdale, S.L., Foster, E.F., Coteus, P.W.
Published in IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging (01.05.1996)
Published in IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging (01.05.1996)
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Journal Article
Method for fabricating multi-layer thin film structure having a separation layer
ARJAVALINGAM; GNANALINGAM, SHAW; JANE M, RANIERI; VINCENT, OPRYSKO; MODEST M, FURMAN; BRUCE K, PURUSHOTHAMAN; SAMPATH, WILCZYNSKI; JANUSZ S, DOANY; FUAD E, WITMAN; DAVID F, NARAYAN; CHANDRASEKHAR, DEUTSCH; ALINA, HUNT; DONALD J, RENICK; STEPHEN
Year of Publication 09.07.1996
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Year of Publication 09.07.1996
Patent
Multi-layer thin film structure and parallel processing method for fabricating same
ARJAVALINGAM; GNANALINGAM, SHAW; JANE M, RANIERI; VINCENT, OPRYSKO; MODEST M, FURMAN; BRUCE K, PURUSHOTHAMAN; SAMPATH, WILCZYNSKI; JANUSZ S, DOANY; FUAD E, WITMAN; DAVID F, NARAYAN; CHANDRASEKHAR, DEUTSCH; ALINA, HUNT; DONALD J, RENICK; STEPHEN
Year of Publication 02.11.1993
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Year of Publication 02.11.1993
Patent
Factors affecting the interconnection resistance and yield in multilayer polyimide/copper structures
Shih, D.-Y., Yeh, H.L., Paraszczak, J., Lewis, J., Graham, W., Nunes, S., Narayan, C., McGouey, R., Galligan, E., Cataldo, J., Serino, R., Perfecto, E., Chang, C.-A., Deutsch, A., Rothman, L., Ritsko, J.J., Wilczynski, J.S.
Published in IEEE transactions on components, hybrids, and manufacturing technology (01.02.1993)
Published in IEEE transactions on components, hybrids, and manufacturing technology (01.02.1993)
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