Low-temperature all-Cu interconnections formed by pressure-less sintering of Cu-pillars with nanoporous-Cu caps
Sosa, Ramon A., Mohan, Kashyap, Antoniou, Antonia, Smet, Vanessa, Thienpont, Denise, Tan, YY
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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