Multiring Circular Transmission Line Model for Ultralow Contact Resistivity Extraction
Hao Yu, Schaekers, Marc, Schram, Tom, Rosseel, Erik, Martens, Koen, Demuynck, Steven, Horiguchi, Naoto, Barla, Kathy, Collaert, Nadine, De Meyer, Kristin, Thean, Aaron
Published in IEEE electron device letters (01.06.2015)
Published in IEEE electron device letters (01.06.2015)
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Journal Article
Thermal Stability Concern of Metal-Insulator-Semiconductor Contact: A Case Study of Ti/TiO2/n-Si Contact
Hao Yu, Schaekers, Marc, Schram, Tom, Demuynck, Steven, Horiguchi, Naoto, Barla, Kathy, Collaert, Nadine, Thean, Aaron Voon-Yew, De Meyer, Kristin
Published in IEEE transactions on electron devices (01.07.2016)
Published in IEEE transactions on electron devices (01.07.2016)
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Journal Article
CMOS integration of high-k/metal gate transistors in diffusion and gate replacement (D&GR) scheme for dynamic random access memory peripheral circuits
Litta, Eugenio Dentoni, Ritzenthaler, Romain, Schram, Tom, Spessot, Alessio, O Sullivan, Barry, Machkaoutsan, Vladimir, Fazan, Pierre, Ji, Yunhyuck, Mannaert, Geert, Lorant, Christophe, Sebaai, Farid, Thiam, Arame, Ercken, Monique, Demuynck, Steven, Horiguchi, Naoto
Published in Japanese Journal of Applied Physics (01.04.2018)
Published in Japanese Journal of Applied Physics (01.04.2018)
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Journal Article
Integration and Dielectric Reliability of 30 nm Half Pitch Structures in Aurora ® LK HM
Demuynck, Steven, Huffman, Craig, Claes, Martine, Suhard, Samuel, Versluijs, Janko, Volders, Henny, Heylen, Nancy, Kellens, Kristof, Croes, Kristof, Struyf, Herbert, Vereecke, Guy, Verdonck, Patrick, Roest, David De, Beynet, Julien, Sprey, Hessel, Beyer, Gerald P.
Published in Japanese Journal of Applied Physics (01.04.2010)
Published in Japanese Journal of Applied Physics (01.04.2010)
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Journal Article
Dielectric Reliability of 50nm Half Pitch Structures in Aurora® LK
Demuynck, S., Kim, H., Huffman, C., Darnon, Maxime, .Struyf, H., Versluijs, J., Claes, M., Vereecke, G., Verdonck, P., Volders, H., Heylen, N., Kellens, K., de Roest, D., Sprey, H., Beyer, G.
Published in Japanese Journal of Applied Physics (01.04.2009)
Published in Japanese Journal of Applied Physics (01.04.2009)
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Journal Article
Dielectric Reliability of 50 nm Half Pitch Structures in Aurora ® LK
Demuynck, Steven, Kim, Honggun, Huffman, Craig, Darnon, Maxime, Struyf, Herbert, Versluijs, Janko, Claes, Martine, Vereecke, Guy, Verdonck, Patrick, Volders, Henny, Heylen, Nancy, Kellens, Kristof, Roest, David De, Sprey, Hessel, Beyer, Gerald
Published in Japanese Journal of Applied Physics (01.04.2009)
Published in Japanese Journal of Applied Physics (01.04.2009)
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Journal Article
Integration of Porogen-Based Low-$k$ Films: Influence of Capping Layer Thickness and Long Thermal Anneals on Low-$k$ Damage and Reliability
Roest, David De, Vereecke, Bart, Huffman, Craig, Heylen, Nancy, Croes, Kristof, Arai, Hirofumi, Takamure, Noboru, Beynet, Julien, Sprey, Hessel, Matsushita, Kiyohiro, Kobayashi, Nobuyoshi, Verdonck, Patrick, Demuynck, Steven, Beyer, Gerald, Tokei, Zsolt, Struyf, Herbert
Published in Japanese Journal of Applied Physics (01.05.2010)
Published in Japanese Journal of Applied Physics (01.05.2010)
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Journal Article
Process Variation Analysis of Device Performance Using Virtual Fabrication: Methodology Demonstrated on a CMOS 14-nm FinFET Vehicle
Vincent, Benjamin, Hathwar, Raghu, Kamon, Mattan, Ervin, Joseph, Schram, Tom, Chiarella, Thomas, Demuynck, Steven, Baudot, Sylvain, Siew, Yong Kong, Kubicek, Stenfan, Litta, Eugenio Dentoni, Chew, SoonAik, Mitard, Jerome
Published in IEEE transactions on electron devices (01.12.2020)
Published in IEEE transactions on electron devices (01.12.2020)
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Journal Article
Source/Drain Epitaxy for Nanosheet-Based CFET Devices
Rosseel, Erik, Porret, Clement, Dursap, Thomas, Loo, Roger, Mertens, Hans, Ganguly, Jishnu, Sarkar, Ritam, Cavalcante, Camila, Richard, Olivier, Geypen, Jef, Marozas, Brendan, Casey, Daniel, Khazaka, Rami, Demuynck, Steven, P. B. Lima, Lucas, Langer, Robert, Biesemans, Serge, Horiguchi, Naoto
Published in ECS transactions (27.09.2024)
Published in ECS transactions (27.09.2024)
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Journal Article
Buried Power Rail Integration With FinFETs for Ultimate CMOS Scaling
Gupta, Anshul, Pedreira, Olalla Varela, Arutchelvan, Goutham, Zahedmanesh, Houman, Devriendt, Katia, Mertens, Hans, Tao, Zheng, Ritzenthaler, Romain, Wang, Shouhua, Radisic, Dunja, Kenis, Karine, Teugels, Lieve, Sebai, Farid, Lorant, Christophe, Jourdan, Nicolas, Chan, Boon Teik, Subramanian, Sujith, Schleicher, Filip, Hopf, Toby, Peter, Antony Premkumar, Rassoul, Nouredine, Debruyn, Haroen, Demonie, Ingrid, Siew, Yong Kong, Chiarella, Thomas, Briggs, Basoene, Zhou, Xiuju, Rosseel, Erik, De Keersgieter, An, Capogreco, Elena, Litta, Eugenio Dentoni, Boccardi, Guillaume, Baudot, Sylvain, Mannaert, Geert, Bontemps, Noemie, Sepulveda, A., Mertens, Sofie, Kim, Min-Soo, Dupuy, Emmanuel, Vandersmissen, Kevin, Paolillo, Sara, Yakimets, Dmitry, Chehab, Bilal, Favia, Paola, Drijbooms, Christel, Cousserier, Joris, Jaysankar, Manoj, Lazzarino, Frederic, Morin, Pierre, Altamirano, Efrain, Mitard, Jerome, Wilson, Christopher J., Holsteyns, Frank, Boemmels, Juergen, Demuynck, Steven, Tokei, Zsolt, Horiguchi, Naoto
Published in IEEE transactions on electron devices (01.12.2020)
Published in IEEE transactions on electron devices (01.12.2020)
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Journal Article
MIS or MS? Source/drain contact scheme evaluation for 7nm Si CMOS technology and beyond
Hao Yu, Schaekers, Marc, Demuynck, Steven, Barla, Kathy, Mocuta, Anda, Horiguchi, Naoto, Collaert, Nadine, Thean, Aaron Voon-Yew, De Meyer, Kristin
Published in 2016 16th International Workshop on Junction Technology (IWJT) (01.05.2016)
Published in 2016 16th International Workshop on Junction Technology (IWJT) (01.05.2016)
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Conference Proceeding
New methodology for modelling MOL TDDB coping with variability
Roussel, Philippe J., Chasin, Adrian, Demuynck, Steven, Horiguchi, Naoto, Linten, Dimitri, Mocuta, Anda
Published in 2018 IEEE International Reliability Physics Symposium (IRPS) (01.03.2018)
Published in 2018 IEEE International Reliability Physics Symposium (IRPS) (01.03.2018)
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Conference Proceeding
Thermal Stability Concern of Metal-Insulator-Semiconductor Contact: A Case Study of Ti/TiO sub(2)/n-Si Contact
Yu, Hao, Schaekers, Marc, Schram, Tom, Demuynck, Steven, Horiguchi, Naoto, Barla, Kathy, Collaert, Nadine, Thean, Aaron Voon-Yew, De Meyer, Kristin
Published in IEEE transactions on electron devices (01.07.2016)
Published in IEEE transactions on electron devices (01.07.2016)
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Journal Article
Thermal Stability Concern of Metal-Insulator-Semiconductor Contact: A Case Study of Ti/TiO 2 /n-Si Contact
Yu, Hao, Schaekers, Marc, Schram, Tom, Demuynck, Steven, Horiguchi, Naoto, Barla, Kathy, Collaert, Nadine, Thean, Aaron Voon-Yew, De Meyer, Kristin
Published in IEEE transactions on electron devices (01.07.2016)
Published in IEEE transactions on electron devices (01.07.2016)
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Journal Article
Channel Length Dependence of PBTI in High-k First RMG Gate Stack Integration Scheme
Parihar, Narendra, Arutchelvan, Goutham, Franco, Jacopo, Baudot, Sylvain, Opedebeeck, Ann, Demuynck, Steven, Arimura, Hiroaki, Ragnarsson, Lars-Ake, Mitard, Jerome, De Heyn, Vincent, Mercha, Abdelkarim
Published in 2021 IEEE International Integrated Reliability Workshop (IIRW) (04.10.2021)
Published in 2021 IEEE International Integrated Reliability Workshop (IIRW) (04.10.2021)
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Conference Proceeding
Titanium Silicide on Si:P With Precontact Amorphization Implantation Treatment: Contact Resistivity Approaching 1 \times 10^ Ohm-cm2
Hao Yu, Schaekers, Marc, Peter, Anthony, Pourtois, Geoffrey, Rosseel, Erik, Joon-Gon Lee, Woo-Bin Song, Keo Myoung Shin, Everaert, Jean-Luc, Soon Aik Chew, Demuynck, Steven, Daeyong Kim, Barla, Kathy, Mocuta, Anda, Horiguchi, Naoto, Thean, Aaron Voon-Yew, Collaert, Nadine, De Meyer, Kristin
Published in IEEE transactions on electron devices (01.12.2016)
Published in IEEE transactions on electron devices (01.12.2016)
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Journal Article
Full reliability study of advanced metallization options for 30 nm A12pitch interconnects
Croes, Kristof, Demuynck, Steven, Siew, Yong, Pantouvaki, Marianna, Wilson, Christopher, Heylen, Nancy, Beyer, Gerald, TAkei, Zsolt
Published in Microelectronic engineering (01.06.2013)
Published in Microelectronic engineering (01.06.2013)
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Journal Article
Full reliability study of advanced metallization options for 30nm ½pitch interconnects
Croes, Kristof, Demuynck, Steven, Siew, Yong Kong, Pantouvaki, Marianna, Wilson, Christopher J., Heylen, Nancy, Beyer, Gerald P., Tőkei, Zsolt
Published in Microelectronic engineering (01.06.2013)
Published in Microelectronic engineering (01.06.2013)
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Journal Article
(Invited) Gate-All-Around Transistors Based on Vertically Stacked Si Nanowires
Mertens, Hans, Ritzenthaler, Romain, Hikavyy, Andriy Yakovitch, Kim, Min-Soo, Tao, Zheng, Wostyn, Kurt, Schram, Tom, Kunnen, Eddy, Ragnarsson, Lars-Åke, Dekkers, Harold F. W., Hopf, Toby, Devriendt, Katia, Tsvetanova, Diana, Chew, Soon Aik, Kikuchi, Yoshiaki, Van Besien, Els, Rosseel, Erik, Mannaert, Geert, De Keersgieter, An, Chasin, Adrian, Kubicek, Stefan, Dangol, Anish, Demuynck, Steven, Barla, Kathy, Mocuta, Dan, Horiguchi, Naoto
Published in ECS transactions (26.04.2017)
Published in ECS transactions (26.04.2017)
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Journal Article
Reliability of MOL local interconnects
Kauerauf, T., Branka, A., Sorrentino, G., Roussel, P., Demuynck, S., Croes, K., Mercha, K., Bommels, J., Tokei, Z., Groeseneken, G.
Published in 2013 IEEE International Reliability Physics Symposium (IRPS) (01.04.2013)
Published in 2013 IEEE International Reliability Physics Symposium (IRPS) (01.04.2013)
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Conference Proceeding