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NOORI, Atif M, BALSEANU, Mihaela, LAUWERS, Anne, LEE, Wen-Chin, JIANXIN LEI, MANDREKAR, Tushar, SCHREUTELKAMP, Robert, SHAH, Kavita, THOMPSON, Scott E, VERHEYEN, Peter, WANG, Ching-Ya, XIA, Li-Qun, BOELEN, Pieter, ARGHAVANI, Reza, COCKBUM, Andrew, DEMUYNCK, Steven, FELCH, Susan, GANDIKOTA, Srinivas, JERRY GELATOS, A, KHANDELWAL, Amit, KITTL, Jorge A
Published in IEEE transactions on electron devices (01.05.2008)
Published in IEEE transactions on electron devices (01.05.2008)
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Journal Article
Full reliability study of advanced metallization options for 30 nm ½pitch interconnects
CROES, Kristof, DEMUYNCK, Steven, SIEW, Yong Kong, PANTOUVAKI, Marianna, WILSON, Christopher J, HEYLEN, Nancy, BEYER, Gerald P, TOKEI, Zsolt
Published in Microelectronic engineering (2013)
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Published in Microelectronic engineering (2013)
Conference Proceeding
Direct Copper Electrochemical Deposition on Ru-Based Substrates for Advanced Interconnects Target 30 nm and 1/2 Pitch Lines: From Coupon to Full-Wafer Experiments
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Published in ECS transactions (01.01.2011)
Published in ECS transactions (01.01.2011)
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Journal Article
Integration and Dielectric Reliability of 30 nm Half Pitch Structures in Aurora\text{\textregistered LK HM
Demuynck, Steven, Huffman, Craig, Claes, Martine, Suhard, Samuel, Versluijs, Janko, Volders, Henny, Heylen, Nancy, Kellens, Kristof, Croes, Kristof, Struyf, Herbert, Vereecke, Guy, Verdonck, Patrick, De Roest, David, Beynet, Julien, Sprey, Hessel, Beyer, Gerald P
Published in Jpn J Appl Phys (25.04.2010)
Published in Jpn J Appl Phys (25.04.2010)
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Journal Article
Initial void chacterization in 30nm wide polycrystalline Cu line using a local sense EM test structure
Kirimura, T., Croes, K., Yunlong Li, Demuynck, S., Wilson, C. J., Lofrano, M., Tokei, Z.
Published in 2012 IEEE International Reliability Physics Symposium (IRPS) (01.04.2012)
Published in 2012 IEEE International Reliability Physics Symposium (IRPS) (01.04.2012)
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Conference Proceeding