On the interpretation of Mossbauer isomer shifts
Vries, J W C de, Thiel, R C, Buschow, K H J
Published in Journal of physics. F, Metal physics (01.11.1985)
Published in Journal of physics. F, Metal physics (01.11.1985)
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Journal Article
Impact of geometry on stretchable meandered interconnect uniaxial tensile extension fatigue reliability
Jablonski, M., Lucchini, R., Bossuyt, F., Vervust, T., Vanfleteren, J., De Vries, J.W.C., Vena, P., Gonzalez, M.
Published in Microelectronics and reliability (01.01.2015)
Published in Microelectronics and reliability (01.01.2015)
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Journal Article
Preparation and transport properties of superconducting layers in the Ca-Sr-Bi-Cu-O system
Klee, M., Stollman, G.M., Stotz, S., de Vries, J.W.C.
Published in Solid state communications (01.08.1988)
Published in Solid state communications (01.08.1988)
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Journal Article
Volume effects on the Mossbauer isomer shift in intermetallic compounds containing gadolinium
Vries, J W C de, Thiel, R C, Buschow, K H J
Published in Journal of physics. F, Metal physics (01.06.1985)
Published in Journal of physics. F, Metal physics (01.06.1985)
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Journal Article
Quantifying moisture diffusion into three-dimensional axisymmetric sealants
Leslie, D., Dasgupta, A., de Vries, J. W. C.
Published in 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2013)
Published in 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2013)
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Conference Proceeding
A Study of Acoustic Emission in Piezoelectric Multilayer Ceramic Actuator
Aburatani, Hideaki, Yoshikawa, Shoko, de Vries, Kenji Uchino
Published in Japanese Journal of Applied Physics (01.01.1998)
Published in Japanese Journal of Applied Physics (01.01.1998)
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Journal Article
Fatigue model based on average cross-section strain of Cu trace cyclic bending
Farley, D, Dasgupta, A, Zhou, Y, Caers, J F J, De Vries, J W C
Published in 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2011)
Published in 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2011)
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Conference Proceeding
A Component Level Test Method for Evaluating the Resistance of Pb-free BGA Solder Joints to Brittle Fracture under Shock Impact
Zhao, X.J., Caers, J.F.J.M., de Vries, J.W.C., Wong, E.H., Rajoo, R.
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
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Conference Proceeding
Vibration durability of Pb-free HVQFN assemblies
Choi, C, Al-Bassyiouni, M, Dasgupta, A, de Vries, J W C, Balemans, Will, van Driel, W
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
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Conference Proceeding
Improvement of mechanical impact resistance of BGA packages with Pb-free solder bumps
Zhao, X.J., Caers, J.F.J.M., de Vries, J.W.C., Kloosterman, J., Wong, E.H., Rajoo, R.
Published in 2006 8th Electronics Packaging Technology Conference (01.12.2006)
Published in 2006 8th Electronics Packaging Technology Conference (01.12.2006)
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Conference Proceeding