A Design of Experiment Study of Nanoprecipitation and Nano Spray Drying as Processes to Prepare PLGA Nano- and Microparticles with Defined Sizes and Size Distributions
Draheim, Christina, de Crécy, Francois, Hansen, Steffi, Collnot, Eva-Maria, Lehr, Claus-Michael
Published in Pharmaceutical research (01.08.2015)
Published in Pharmaceutical research (01.08.2015)
Get full text
Journal Article
The development of high quality seals for silicon patch-clamp chips
Sordel, Thomas, Kermarrec, Frédérique, Sinquin, Yann, Fonteille, Isabelle, Labeau, Michel, Sauter-Starace, Fabien, Pudda, Catherine, de Crécy, François, Chatelain, François, De Waard, Michel, Arnoult, Christophe, Picollet-D’hahan, Nathalie
Published in Biomaterials (01.10.2010)
Published in Biomaterials (01.10.2010)
Get full text
Journal Article
Thermal Effects of Silicon Thickness in 3-D ICs: Measurements and Simulations
Souare, Papa Momar, Fiori, Vincent, Farcy, Alexis, de Crecy, Francois, Ben Jamaa, Haykel, Borbely, Andras, Coudrain, Perceval, Colonna, Jean-Philippe, Gallois-Garreignot, Sebastien, Giraud, Bastien, Cheramy, Severine, Tavernier, Clement, Michailos, Jean
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.08.2014)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.08.2014)
Get full text
Journal Article
Preparation and characterization of highly stable lipid nanoparticles with amorphous core of tuneable viscosity
Delmas, Thomas, Couffin, Anne-Claude, Bayle, Pierre Alain, Crécy, François de, Neumann, Emmanuelle, Vinet, Françoise, Bardet, Michel, Bibette, Jérôme, Texier, Isabelle
Published in Journal of colloid and interface science (15.08.2011)
Published in Journal of colloid and interface science (15.08.2011)
Get full text
Journal Article
Using TSVs for thermal mitigation in 3D circuits: Wish and truth
Santos, Cristiano, Momar Souare, Papa, de Crecy, Francois, Coudrain, Perceval, Colonna, Jean-Philippe, Vivet, Pascal, Borbely, Andras, Reis, Ricardo, Ben Jamaa, Haykel, Fiori, Vincent, Farcy, Alexis
Published in 2014 International 3D Systems Integration Conference (3DIC) (01.12.2014)
Published in 2014 International 3D Systems Integration Conference (3DIC) (01.12.2014)
Get full text
Conference Proceeding
Challenges for 3D IC integration: bonding quality and thermal management
Leduc, Patrick, Sillon, Nicolas, Maitrejean, Sylvain, Louis, Didier, Passemard, Gerard, de Crecy, Francois, Fayolle, Murielle, Charlet, Barbara, Enot, Thierry, Zussy, Marc, Jones, Bob, Barbe, Jean-Charles, Kernevez, Nelly
Published in 2007 IEEE International Interconnect Technology Conferencee (01.06.2007)
Published in 2007 IEEE International Interconnect Technology Conferencee (01.06.2007)
Get full text
Conference Proceeding
Thermal behavior of stack-based 3D ICs
Souare, Papa Momar, de Crecy, Francois, Fiori, Vincent, Ben Jamaa, Haykel, Farcy, Alexis, Gallois-Garreignot, Sebastien, Borbely, Andras, Lhostis, Sandrine, Leduc, Patrick, Cheramy, Severine, Tavernier, Clement, Michailos, Jean
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
Published in 2012 4th Electronic System-Integration Technology Conference (01.09.2012)
Get full text
Conference Proceeding
Application of Design of Computer Experiments (DoCE) method for the extraction of the elasto-plastic behavior law of ECD copper through nano-indentation tests
Moreau, Stephane, de Crecy, Francois, Mandrillon, Vincent
Published in 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2015)
Published in 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2015)
Get full text
Conference Proceeding
Test structure for characterizing metal thickness in damascene CMP technology
Toffoli, A., Maitrejean, S., Duport de Pontcharra, J., de Crecy, F., Bouchu, D., Arnaud, L., Boulanger, F.
Published in 2008 IEEE International Conference on Microelectronic Test Structures (01.03.2008)
Published in 2008 IEEE International Conference on Microelectronic Test Structures (01.03.2008)
Get full text
Conference Proceeding
Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits
Coudrain, Perceval, Souare, Papa Momar, Prieto, Rafael, Fiori, Vincent, Farcy, Alexis, Le Pailleur, Laurent, Colonna, Jean-Philippe, Santos, Cristiano, Vivet, Pascal, Ben-Jamaa, Haykel, Dutoit, Denis, de Crecy, Francois, Dumas, Sylvain, Chancel, Christian, Lattard, Didier, Cheramy, Severine
Published in IEEE design and test (01.06.2016)
Published in IEEE design and test (01.06.2016)
Get full text
Magazine Article
Impact of integrating microchannel cooling within 3D microelectronic packages for portable applications
Collin, Louis-Michel, Frechette, Luc G., Souifi, Abdelkader, Lhostis, Sandrine, de Crecy, Francois, Cheramy, Severine, Colonna, Jean-Philippe, Fiori, Vincent
Published in 2013 Eurpoean Microelectronics Packaging Conference (EMPC) (01.09.2013)
Get full text
Published in 2013 Eurpoean Microelectronics Packaging Conference (EMPC) (01.09.2013)
Conference Proceeding
Optimized thermal management fuel cell
Laurent, Jean-Yves, Marsacq, Didier, Ternay, Francis, De Crecy, Francois
Year of Publication 02.09.2004
Get full text
Year of Publication 02.09.2004
Patent