Semiconductor package with releasable isolation layer protection
DAREYEW YEVGENIY BORISOVICH, FONG CHII SHING, LIE HUIJUN, ZHANG LIFANG, QASEM AHMAD
Year of Publication 23.12.2022
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Year of Publication 23.12.2022
Patent
Semiconductor package including package body formed with recess
QIU MEIFEN, FONG CHII SHING, DAREYEW YEVGENIY BORISOVICH, OTREMBA RALF, FUERGUT EDWARD, SCHMOELZER BERND, ZHANG LIFANG, WANG LEE SHUANG, QASEM AHMAD, CHEN YUNXIAN
Year of Publication 19.09.2023
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Year of Publication 19.09.2023
Patent