Hierarchical architectures of monodisperse porous Cu microspheres: synthesis, growth mechanism, high-efficiency and recyclable catalytic performance
Zhang, Yu, Zhu, Pengli, Chen, Liang, Li, Gang, Zhou, Fengrui, Lu, Daoqiang (Daniel), Sun, Rong, Zhou, Feng, Wong, Ching-ping
Published in Journal of materials chemistry. A, Materials for energy and sustainability (14.08.2014)
Published in Journal of materials chemistry. A, Materials for energy and sustainability (14.08.2014)
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Journal Article
Highly stable and re-dispersible nano Cu hydrosols with sensitively size-dependent catalytic and antibacterial activities
Zhang, Yu, Zhu, Pengli, Li, Gang, Wang, Wenzhao, Chen, Liang, Lu, Daoqiang Daniel, Sun, Rong, Zhou, Feng, Wong, Chingping
Published in Nanoscale (28.08.2015)
Published in Nanoscale (28.08.2015)
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Journal Article
Process optimization and identification of antioxidant peptides from enzymatic hydrolysate of bovine bone extract, a potential source in cultured meat
Begum, Nabila, Khan, Qudrat Ullah, Al-Dalali, Sam, Lu, Daoqiang, Yang, Fang, Li, Jie, Wu, Di, Li, Riwang, Wang, Jun, Liu, Dahai, Song, Huanlu
Published in Frontiers in sustainable food systems (07.02.2024)
Published in Frontiers in sustainable food systems (07.02.2024)
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Journal Article
Core-shell SiO sub(2)[at]RGO hybrids for epoxy composites with low percolation threshold and enhanced thermo-mechanical properties
Huang, Liang, Zhu, Pengli, Li, Gang, Lu, Daoqiang, Sun, Rong, Wong, Chingping
Published in Journal of materials chemistry. A, Materials for energy and sustainability (01.10.2014)
Published in Journal of materials chemistry. A, Materials for energy and sustainability (01.10.2014)
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Journal Article
Screening of potentially active compounds against rheumatoid arthritis in the Juan-Bi decoction using systems pharmacology and animal experiments
Liu, Dahai, Fu, Qiang, Liu, Leyna G, Li, Wenwen, Qi, Fei, Liu, Justin, Shang, Lifeng, Wang, Xiu, Yang, Fang, Li, Jie, Lu, Daoqiang, Feng, Huiying, Zhang, Ziwen, Chen, Yiqing, Liang, Junru, Yao, Jiayi, Lv, Hua, Li, Riwang, Wang, Jun, Wu, Di, Liu, Yuxi, Xia, Chenglai, Li, Wenxing
Published in Frontiers in cell and developmental biology (25.06.2024)
Published in Frontiers in cell and developmental biology (25.06.2024)
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Journal Article
Recent Advances in Nano-conductive Adhesives
Daniel Lu, Daoqiang, Grace Li, Yi, Wong, C. P.
Published in Journal of adhesion science and technology (01.01.2008)
Published in Journal of adhesion science and technology (01.01.2008)
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Journal Article
Recent Advances in Developing High Performance Isotropic Conductive Adhesives
Daniel Lu, Daoqiang, Wong, C. P.
Published in Journal of adhesion science and technology (01.01.2008)
Published in Journal of adhesion science and technology (01.01.2008)
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Journal Article
A study of impact performance of conductive adhesives
Rao, Yang, Lu, Daoqiang, Wong, C.P.
Published in International journal of adhesion and adhesives (01.10.2004)
Published in International journal of adhesion and adhesives (01.10.2004)
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Journal Article
Structure-property relationships between microscopic filler surface chemistry and macroscopic rheological, thermo-mechanical, and adhesive performance of SiO2 filled nanocomposite underfills
Li, Gang, Zhao, Tao, Zhu, Pengli, He, Yachuan, Sun, Rong, Lu, Daoqiang, Wong, Ching-ping
Published in Composites. Part A, Applied science and manufacturing (01.03.2019)
Published in Composites. Part A, Applied science and manufacturing (01.03.2019)
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Journal Article
Copper Salts Mediated Morphological Transformation of Cu2O from Cubes to Hierarchical Flower-like or Microspheres and Their Supercapacitors Performances
Chen, Liang, Zhang, Yu, Zhu, Pengli, Zhou, Fengrui, Zeng, Wenjin, Lu, Daoqiang Daniel, Sun, Rong, Wong, Chingping
Published in Scientific reports (10.04.2015)
Published in Scientific reports (10.04.2015)
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Journal Article
Conductivity mechanisms of isotropic conductive adhesives (ICAs)
Daoqiang Lu, Tong, Q.K., Wong, C.P.
Published in IEEE transactions on electronics packaging manufacturing (01.07.1999)
Published in IEEE transactions on electronics packaging manufacturing (01.07.1999)
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Journal Article
Mechanisms underlying the unstable contact resistance of conductive adhesives
Daoqiang Lu, Tong, Q.K., Wong, C.P.
Published in IEEE transactions on electronics packaging manufacturing (01.07.1999)
Published in IEEE transactions on electronics packaging manufacturing (01.07.1999)
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Journal Article
Study on the effects of interfacial interaction on the rheological and thermal performance of silica nanoparticles reinforced epoxy nanocomposites
Guo, Qian, Zhu, Pengli, Li, Gang, Wen, Junjie, Wang, Tianyu, Lu, Daoqiang (Daniel), Sun, Rong, Wong, Chingping
Published in Composites. Part B, Engineering (01.05.2017)
Published in Composites. Part B, Engineering (01.05.2017)
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Journal Article
A highly stretchable, adhesive, and antibacterial hydrogel with chitosan and tobramycin as dynamic cross-linkers for treating the infected diabetic wound
Xu, Anqi, Zhang, Nan, Su, Shixing, Shi, Hongyu, Lu, Daoqiang, Li, Xifeng, Zhang, Xin, Feng, Xin, Wen, Zhuohua, Ma, Gengwu, Huang, Mengshi, Huang, Chi, Hu, Yuqi, Yuan, Hao, Liu, Qinwen, Guan, Daogang, Wang, Jun, Duan, Chuanzhi
Published in Carbohydrate polymers (15.01.2024)
Published in Carbohydrate polymers (15.01.2024)
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Journal Article
Spherical and flake-like BN filled epoxy composites: morphological effect on the thermal conductivity, thermo-mechanical and dielectric properties
Huang, Liang, Zhu, Pengli, Li, Gang, Zhou, Fengrui, Lu, Daoqiang, Sun, Rong, Wong, Chingping
Published in Journal of materials science. Materials in electronics (01.06.2015)
Published in Journal of materials science. Materials in electronics (01.06.2015)
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Journal Article
A study of lubricants on silver flakes for microelectronics conductive adhesives
Daoqiang Lu, Tong, Q.K., Wong, C.P.
Published in IEEE transactions on components and packaging technologies (01.09.1999)
Published in IEEE transactions on components and packaging technologies (01.09.1999)
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Journal Article
Preparation of novel injectable photo-crosslinked collagen gels by a fast and simple method
Li, Riwang, Li, Jie, Lu, Daoqiang, zhang, Ziwen, Li, Na, Wu, Di, Wang, Jun, Feng, Huiying, Zhang, Wanying, Chen, Yingying, Liu, Dahai, Ai, Yilong, Li, Lihua
Published in Materials letters (01.04.2023)
Published in Materials letters (01.04.2023)
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