Improved Reliability of Planar Power Interconnect With Ceramic-Based Structure
Hui Zhang, Jianfeng Li, Jingru Dai, Corfield, Martin, Xuejian Liu, Yan Liu, Zhengren Huang, Johnson, Christopher Mark
Published in IEEE journal of emerging and selected topics in power electronics (01.03.2018)
Published in IEEE journal of emerging and selected topics in power electronics (01.03.2018)
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Journal Article
Low-Temperature Die Attachment by Pressureless Cu Sintering for Semiconductor Packaging
Dai, Jingru, Wang, Yangang, Grant, Thomas, Morshed, Muhmmad
Published in Journal of electronic materials (01.11.2023)
Published in Journal of electronic materials (01.11.2023)
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Journal Article
Microstructural Response of Highly Porous Sintered Nano-silver Particle Die Attachments to Thermomechanical Cycling
Agyakwa, Pearl A., Robertson, Stuart, Dai, Jingru, Mouawad, Bassem, Zhou, Zhaoxia, Liu, Changqing, Johnson, C. Mark
Published in Journal of electronic materials (01.03.2024)
Published in Journal of electronic materials (01.03.2024)
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Journal Article
Electrical Performance and Reliability Characterization of a SiC MOSFET Power Module With Embedded Decoupling Capacitors
Yang, Li, Li, Ke, Dai, Jingru, Corfield, Martin, Harris, Anne, Paciura, Krzysztof, O Brien, John, Johnson, C. Mark
Published in IEEE transactions on power electronics (01.12.2018)
Published in IEEE transactions on power electronics (01.12.2018)
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Journal Article
Estimation of Daily Winter Precipitation in the Snowy Mountains of Southeastern Australia
Dai, Jingru, Manton, Michael J., Siems, Steven T., Ebert, Elizabeth E.
Published in Journal of hydrometeorology (01.06.2014)
Published in Journal of hydrometeorology (01.06.2014)
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Journal Article
Comparative Thermal and Structural Characterization of Sintered Nano-Silver and High-Lead Solder Die Attachments During Power Cycling
Dai, Jingru, Li, Jianfeng, Agyakwa, Pearl, Corfield, Martin, Johnson, Christopher Mark
Published in IEEE transactions on device and materials reliability (01.06.2018)
Published in IEEE transactions on device and materials reliability (01.06.2018)
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Magazine Article
Thermal performance and reliability of high temperature SiC power module with direct-cooled stacked Si3N4 substrates
Dai, Jingru, Li, Jianfeng, Mouawad, Bassem, Johnson, Christopher Mark
Published in 2018 1st Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia) (01.05.2018)
Published in 2018 1st Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia) (01.05.2018)
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Conference Proceeding
A High Performance and Low Cost Half Bridge IGBT Planar Power Module
Li, Jainfeng, Li, Ke, Dai, Jingru, Johnson, Christopher Mark, Lin, Xi
Published in 2018 19th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2018)
Published in 2018 19th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2018)
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Conference Proceeding
Centrifugal machine bearing dismounting device
CAI SHIHENG, MA SHIJIE, DAI GUO'AI, SUN RUOFEI, WANG JUNKAI, DAI JINGRU, XU YAWEI, TIAN LEILEI
Year of Publication 23.09.2022
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Year of Publication 23.09.2022
Patent