Catalyst-free approach for growth of graphene sheets on high-density silica nanowires by CVD
Wang, Ziwen, Xue, Zhongying, Wang, Gang, Dai, Jiayun, Zheng, Xiaohu, Ma, Jun, Li, Yonghua, Zhang, Miao
Published in Materials letters (01.01.2016)
Published in Materials letters (01.01.2016)
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Journal Article
Antibacterial ability and hemocompatibility of graphene functionalized germanium
Geng, Hao, Dai, Jiayun, Li, Jinhua, Di, Zengfeng, Liu, Xuanyong
Published in Scientific reports (23.11.2016)
Published in Scientific reports (23.11.2016)
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Journal Article
How Graphene Islands Are Unidirectionally Aligned on the Ge(110) Surface
Dai, Jiayun, Wang, Danxia, Zhang, Miao, Niu, Tianchao, Li, Ang, Ye, Mao, Qiao, Shan, Ding, Guqiao, Xie, Xiaoming, Wang, Yongqiang, Chu, Paul K, Yuan, Qinghong, Di, Zengfeng, Wang, Xi, Ding, Feng, Yakobson, Boris I
Published in Nano letters (11.05.2016)
Published in Nano letters (11.05.2016)
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Journal Article
Heterogeneous Integration for High Performance Electronic and Photonic Devices
Dai, Jiayun, Wang, Fei, Li, Guanyu, Jia, Chenyang, Ling, Zhijian, Chen, Xin, Kong, Yuechan, Chen, Tangsheng
Published in Journal of physics. Conference series (01.04.2024)
Published in Journal of physics. Conference series (01.04.2024)
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Journal Article
A C‐band 370 W MMIC high‐power PIN limiter with heterogeneous integration
Dai, Zhou, Li, Chunyu, Yan, Junda, Dai, Jiayun, Zhang, Tiancheng, Bao, Huaguang, Ding, Dazhi
Published in Microwave and optical technology letters (01.03.2023)
Published in Microwave and optical technology letters (01.03.2023)
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Journal Article
A C‐band 370W MMIC high‐power PIN limiter with heterogeneous integration
Zhou, Dai, Li, Chunyu, Junda Yan, Dai, Jiayun, Zhang, Tiancheng, Bao, Huaguang, Ding, Dazhi
Published in Microwave and optical technology letters (01.03.2023)
Published in Microwave and optical technology letters (01.03.2023)
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Journal Article
High performance wafer scale flexible InP double heterogeneous bipolar transistors
Wu, LiShu, Dai, JiaYun, Wang, Yuan, Kong, YueChan, Chen, TangSheng, Zhang, Tong
Published in Semiconductor science and technology (01.03.2021)
Published in Semiconductor science and technology (01.03.2021)
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Journal Article
Influence of hydrogen fluence on surface blistering of H and He co-implanted Ge
Dai, Jiayun, Xue, Zhongying, Zhang, Miao, Wei, Xing, Wang, Gang, Di, Zengfeng
Published in Nuclear instruments & methods in physics research. Section B, Beam interactions with materials and atoms (01.02.2016)
Published in Nuclear instruments & methods in physics research. Section B, Beam interactions with materials and atoms (01.02.2016)
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Journal Article
Research on Au/Au micro-bump bonding for millimeter wave frequencies heterogeneous integration
Wang, Ming, Dai, Jiayun, Wang, Fei, Kong, Yuechan
Published in 2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP) (15.11.2021)
Published in 2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP) (15.11.2021)
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Conference Proceeding
Low Temperature Wafer Level Au-Au Bonding for Heterogeneous Integration
Wang, Fei, Dai, Jiayun, Cui, Dongyi, Kong, Yuechan
Published in 2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP) (15.11.2021)
Published in 2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP) (15.11.2021)
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Conference Proceeding
Heterogenous Integration of InP DHBT and Si CMOS by 30\mu\mathrm Pitch Au-In Microbumps
Wu, LiShu, Dai, JiaYun, Wei, Cheng, Kong, YueChan, Chen, TangShen, Zhang, Tong
Published in 2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) (08.04.2021)
Published in 2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) (08.04.2021)
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Conference Proceeding