by Convertino, C., Zota, C. B., Caimi, D., Sousa, M., Czornomaz, L.
Published in IEEE journal of the Electron Devices Society (2019)

by Czornomaz, L., Uccelli, E., Sousa, M., Deshpande, V., Djara, V., Caimi, D., Rossell, M. D., Erni, R., Fompeyrine, J.
Published in 2015 Symposium on VLSI Technology (VLSI Technology) (01.06.2015)

by Daix, N., Uccelli, E., Czornomaz, L., Caimi, D., Rossel, C., Sousa, M., Siegwart, H., Marchiori, C., Hartmann, J. M., Shiu, K.-T., Cheng, C.-W., Krishnan, M., Lofaro, M., Kobayashi, M., Sadana, D., Fompeyrine, J.
Published in APL materials (01.08.2014)

by Czornomaz, L., El Kazzi, M., Hopstaken, M., Caimi, D., Mächler, P., Rossel, C., Bjoerk, M., Marchiori, C., Siegwart, H., Fompeyrine, J.
Published in Solid-state electronics (01.08.2012)

by Rossel, C., Weigele, P., Czornomaz, L., Daix, N., Caimi, D., Sousa, M., Fompeyrine, J.
Published in Solid-state electronics (01.08.2014)

by Viallet, B, Ressier, L, Czornomaz, L, Decorde, N
Published in Langmuir (06.04.2010)

by Marchiori, C, El Kazzi, M, Czornomaz, L, Pierucci, D, Silly, M, Sirotti, F, Abel, S, Uccelli, E, Sousa, M, Fompeyrine, J
Published in Journal of physics. D, Applied physics (05.02.2014)

by Czornomaz, L., Djara, V., Deshpande, V., O'Connor, E., Sousa, M., Caimi, D., Cheng, K., Fompeyrine, J.
Published in 2016 IEEE Symposium on VLSI Technology (01.06.2016)

by Djara, V., Deshpande, V., Uccelli, E., Daix, N., Caimi, D., Rossel, C., Sousa, M., Siegwart, H., Marchiori, C., Hartmann, J. M., Shiu, K.-T, Weng, C.-W, Krishnan, M., Lofaro, M., Steiner, R., Sadana, D., Lubyshev, D., Liu, A., Czornomaz, L., Fompeyrine, J.
Published in 2015 Symposium on VLSI Technology (VLSI Technology) (01.06.2015)

by Czornomaz, L., Daix, N., Kerber, P., Lister, K., Caimi, D., Rossel, C., Sousa, M., Uccelli, E., Fompeyrine, J.
Published in 2013 Proceedings of the European Solid-State Device Research Conference (ESSDERC) (01.09.2013)

by El Kazzi, M., Webb, D.J., Czornomaz, L., Rossel, C., Gerl, C., Richter, M., Sousa, M., Caimi, D., Siegwart, H., Fompeyrine, J., Marchiori, C.
Published in Microelectronic engineering (01.07.2011)

by Bufler, F. M., Frey, M., Erlebach, A., Deshpande, V., Czornomaz, L., Djara, V., O'Connor, E., Caimi, D., Fompeyrine, J.
Published in 2016 74th Annual Device Research Conference (DRC) (01.06.2016)

by Hopstaken, M. J. P., Pfeiffer, D., Copel, M., Gordon, M. S., Ando, T., Narayanan, V., Jagannathan, H., Molis, S., Wahl, J. A., Bu, H., Sadana, D. K., Czornomaz, L., Marchiori, C., Fompeyrine, J.
Published in Surface and interface analysis (01.01.2013)

by Daix, N., Czornomaz, L., Caimi, D., Rossel, C., Sousa, M., Fompeyrine, J.
Published in 2013 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) (01.10.2013)

by Czornomaz, L., Daix, N., Uccelli, E., Caimi, D., Sousa, M., Rossel, C., Siegwart, H., Marchiori, C., Fompeyrine, J.
Published in 26th International Conference on Indium Phosphide and Related Materials (IPRM) (01.05.2014)

by Ding, Q., Baumgartner, Y., Czornomaz, L., Schenk, A.
Published in 2020 4th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) (01.04.2020)

by Lee, S., Cheng, C. -W., Sun, X., D'Emic, C., Miyazoe, H., Frank, M. M., Lofaro, M., Bruley, J., Hashemi, P., Ott, J. A., Ando, T., Spratt, W., Cohen, G. M., Lavoie, C., Bruce, R., Patel, J., Schmid, H., Czornomaz, L., Narayanan, V., Mo, R.T., Leobandung, E.
Published in 2018 IEEE International Electron Devices Meeting (IEDM) (01.12.2018)

by Convertino, C., Vergano, L., Czornomaz, L., Zota, C. B., Karg, S.
Published in 2020 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS) (01.09.2020)

by Zota, C. B., Morf, T., Muller, P., Convertino, C., Filipp, S., Riess, W., Czornomaz, L.
Published in 2019 IEEE International Electron Devices Meeting (IEDM) (01.12.2019)

by Convertino, C., Zota, C. B., Baumgartner, Y., Staudinger, P., Sousa, M., Mauthe, S., Caimi, D., Czornomaz, L., Ionescu, A. M., Moselund, K. E.
Published in 2019 IEEE International Electron Devices Meeting (IEDM) (01.12.2019)