Design Issues and Considerations for Low-Cost 3-D TSV IC Technology
Van der Plas, G, Limaye, P, Loi, I, Mercha, A, Oprins, H, Torregiani, C, Thijs, S, Linten, D, Stucchi, M, Katti, G, Velenis, D, Cherman, V, Vandevelde, B, Simons, V, De Wolf, I, Labie, R, Perry, D, Bronckers, S, Minas, N, Cupac, M, Ruythooren, W, Van Olmen, J, Phommahaxay, A, de Potter de ten Broeck, M, Opdebeeck, A, Rakowski, M, De Wachter, B, Dehan, M, Nelis, M, Agarwal, R, Pullini, A, Angiolini, F, Benini, L, Dehaene, W, Travaly, Y, Beyne, E, Marchal, P
Published in IEEE journal of solid-state circuits (01.01.2011)
Published in IEEE journal of solid-state circuits (01.01.2011)
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Journal Article
Conference Proceeding
Design issues and considerations for low-cost 3D TSV IC technology
Van der Plas, G., Limaye, P., Mercha, A., Oprins, H., Torregiani, C., Thijs, S., Linten, D., Stucchi, M., Guruprasad, K., Velenis, D., Shinichi, D., Cherman, V., Vandevelde, B., Simons, V., De Wolf, I., Labie, R., Perry, D., Bronckers, S., Minas, N., Cupac, M., Ruythooren, W., Van Olmen, J., Phommahaxay, A., de Potter de ten Broeck, M., Opdebeeck, A., Rakowski, M., De Wachter, B., Dehan, M., Nelis, M., Agarwal, R., Dehaene, W., Travaly, Y., Marchal, P., Beyne, E.
Published in 2010 IEEE International Solid-State Circuits Conference - (ISSCC) (01.02.2010)
Published in 2010 IEEE International Solid-State Circuits Conference - (ISSCC) (01.02.2010)
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Conference Proceeding
Test structures for characterization of thermal-mechanical stress in 3D stacked IC for analog design
Minas, Nikolaos, Van der Plas, Geert, Oprins, Herman, Yu Yang, Okoro, Chuckwudi, Mercha, Abdelkarim, Cherman, Vladimir, Torregiani, Cristina, Perry, Dan, Cupac, Miro, Rakowski, Michal, Marchal, Pol
Published in 2010 International Conference on Microelectronic Test Structures (ICMTS) (01.03.2010)
Published in 2010 International Conference on Microelectronic Test Structures (ICMTS) (01.03.2010)
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Conference Proceeding
Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack - Challenges and solutions
Van der Plas, G, Thijs, S, Linten, D, Katti, G, Limaye, P, Mercha, A, Stucchi, M, Oprins, H, Vandevelde, B, Minas, N, Cupac, M, Dehan, M, Nelis, M, Agarwal, R, Dehaene, W, Travaly, Y, Beyne, E, Marchal, P
Published in IEEE Custom Integrated Circuits Conference 2010 (01.09.2010)
Published in IEEE Custom Integrated Circuits Conference 2010 (01.09.2010)
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Conference Proceeding
Hardware and a Tool Chain for ADRES
De Sutter, Bjorn, Mei, Bingfeng, Bartic, Andrei, Aa, Tom Vander, Berekovic, Mladen, Mignolet, Jean-Yves, Croes, Kris, Coene, Paul, Cupac, Miro, Couvreur, Aïssa, Folens, Andy, Dupont, Steven, Van Thielen, Bert, Kanstein, Andreas, Kim, Hong-Seok, Kim, Suk Jin
Published in Lecture notes in computer science (2006)
Published in Lecture notes in computer science (2006)
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Book Chapter
Conference Proceeding
Verifying thermal/thermo-mechanical behavior of a 3D stack - challenges and solutions
Marchal, P, Van der Plas, G, Limaye, P, Mercha, A, Thijs, S, Linten, D, Guruprasad, K, Stucchi, M, Vandevelde, B, Bronckers, S, Minas, N, Cupac, M, Dehan, M, Nelis, M, Agarwal, R, Dehaene, W, Travaly, Y, Beyne, E
Published in Proceedings of 2010 International Symposium on VLSI Technology, System and Application (01.04.2010)
Published in Proceedings of 2010 International Symposium on VLSI Technology, System and Application (01.04.2010)
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Conference Proceeding