STI Gap-Fill Technology with High Aspect Ratio Process for 45nm CMOS and beyond
Tilke, A.T., Hampp, R., Stapelmann, C., Culmsee, M., Conti, R., Wille, W., Jaiswal, R., Galiano, M., Jain, A.
Published in The 17th Annual SEMI/IEEE ASMC 2006 Conference (2006)
Published in The 17th Annual SEMI/IEEE ASMC 2006 Conference (2006)
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