by Cui, Chenwei, Pu, Yongping, Shi, Ruike
Published in Journal of alloys and compounds (05.04.2018)

by Cui, Chenwei, Pu, Yongping, Gao, Ziyan, Wan, Jing, Guo, Yisong, Hui, Chiyuan, Wang, Yaru, Cui, Yongfei
Published in Journal of alloys and compounds (15.07.2017)

by Wan, Jing, Pu, Yongping, Hui, Chiyuan, Cui, Chenwei, Guo, Yisong
Published in Journal of materials science. Materials in electronics (01.03.2018)

by Cui, Chenwei, Pu, Yongping
Published in Journal of materials science (01.07.2018)

by Cui, Chenwei, Pu, Yongping
Published in Journal of alloys and compounds (30.05.2018)

by Cui, Chenwei, Pu, Yongping
Published in Journal of materials science (01.07.2018)

by Cui, Chenwei, Pu, Yongping
Published in Journal of alloys and compounds (30.05.2018)

by Cui, Chenwei, Liu, Yun
Published in Electronics letters (06.11.2014)

by Cui, Chenwei, Lu, Liangfu, Tan, Zhiyuan, Hussain, Amir
Published in Neurocomputing (Amsterdam) (13.11.2021)

by Cui, Chenwei, Pu, Yongping, Li, Xin, Cui, Yongfei, Liu, Gang
Published in Materials research bulletin (01.09.2018)

by Liu, Yun, Tian, Yubo, Chen, Yao, Cui, Chenwei
Published in Microelectronics (01.08.2015)

by Cui, Chenwei, Pu, Yongping, Shi, Ruike
Published in Journal of alloys and compounds (05.04.2018)

by Guo, Yisong, Pu, Yongping, Cui, Yongfei, Hui, Chiyuan, Wan, Jing, Cui, Chenwei
Published in Materials letters (01.06.2017)

by Lu, Liangfu, Ren, Xiaohan, Cui, Chenwei, Tan, Zhiyuan, Wu, Yulei, Qin, Zhizhen
Published in Computer networks (Amsterdam, Netherlands : 1999) (05.07.2021)

by Zhang, Lei, Qian, Yijiao, Li, Jinnan, Cui, Chenwei, Chen, Lu, Qu, Shuli, Lu, Shun
Published in Future oncology (London, England) (01.05.2022)

by Guo, Yisong, Pu, Yongping, Cui, Chenwei, Wan, Jing, Hui, Chiyuan
Published in Materials letters (15.05.2018)

by Wang, Bo, Pu, Yongping, Yuan, Qibin, Cui, Chenwei, Shen, Guodong
Published in Journal of materials science. Materials in electronics (30.07.2019)

by Guo, Yisong, Pu, Yongping, Cui, Chenwei, Wan, Jing, Hui, Chiyuan
Published in Materials letters (15.05.2018)

by Hui, Chiyuan, Pu, Yongping, Wan, Jing, Guo, Yisong, Cui, Chenwei
Published in Journal of materials science. Materials in electronics (01.03.2018)

by Wan, Jing, Pu, Yongping, Hui, Chiyuan, Cui, Chenwei, Guo, Yisong
Published in Journal of materials science. Materials in electronics (01.04.2018)