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Year of Publication 02.08.2007
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Power semiconductor package with strap
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Year of Publication 29.03.2005
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Year of Publication 29.03.2005
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Making two lead surface mounting high power microleadframe semiconductor packages
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Year of Publication 29.06.2004
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Year of Publication 29.06.2004
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Power semiconductor package with strap
Crowley, Sean T, Anderson, William M, Boland, Bradley D, Bergman, Eelco
Year of Publication 07.10.2003
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Year of Publication 07.10.2003
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Electronic device package and leadframe
BANCOD LUDOVICO, CROWLEY SEAN T, NIONES EULOGIA A, CHOI YEON HO, KHAM NHUN THUN
Year of Publication 15.01.2002
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Year of Publication 15.01.2002
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Electronic device package and leadframe
Niones, Eulogia A, Kham, Nhun Thun, Bancod, Ludovico, Choi, Yeon Ho, Crowley, Sean T
Year of Publication 15.01.2002
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Year of Publication 15.01.2002
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Electronic device package and leadframe and method for making the package
BANCOD LUDOVICO, CROWLEY SEAN T, NIONES EULOGIA A, CHOI YEON HO, KHAM NHUN THUN
Year of Publication 10.07.2001
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Year of Publication 10.07.2001
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Attaching semiconductor dies to substrates with conductive straps
Crowley, Sean T, Gillett, Blake A, Mauri, Philip S, Belmonte, Ferdinand E, Burro, Jr., Remigio V, Aquino, Jr., Victor M
Year of Publication 01.10.2002
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Year of Publication 01.10.2002
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Attaching semiconductor dies to substrates with conductive straps
MAURI PHILIP S, CROWLEY SEAN T, BURRO REMIGIO V, BELMONTE FERDINAND E, AQUINO VICTOR M, GILLETT BLAKE A
Year of Publication 12.09.2002
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Year of Publication 12.09.2002
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Semiconductor device including metal strap electrically coupled between semiconductor die and metal leadframe
Crowley, Sean T, Gillett, Blake A, Boland, Bradley D, Mauri, Philip S, Belmonte, Ferdinand E, Burro, Jr., Remigio V, Aquino, Jr., Victor M
Year of Publication 16.03.2004
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Year of Publication 16.03.2004
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