Compliant bonding - A new technique for joining microelectronic components
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Conference Proceeding
Direct chip interconnect with adhesive-connector films
Basavanhally, N.R., Chang, D.D., Cranston, B.H., Seger, S.G.
Published in 1992 Proceedings 42nd Electronic Components & Technology Conference (1992)
Published in 1992 Proceedings 42nd Electronic Components & Technology Conference (1992)
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Conference Proceeding