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"Crane, Stanford"
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Modular architecture for high bandwidth computers
by
Crane
,
Stanford
Year of Publication
15.01.2004
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High-density electrical interconnect system
by
Crane
,
Stanford
Year of Publication
16.10.2003
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High-density electrical interconnect system
by
Crane
,
Stanford
Year of Publication
07.03.2002
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Optoelectronic packaging assembly
by
Horvath, Zsolt
,
Crane
,
Stanford
Year of Publication
16.12.2004
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Prefabricated semiconductor chip carrier
by
Portuondo, Maria
,
Crane
,
Stanford
Year of Publication
22.07.2004
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Flex circuit package
by
Crane
,
Stanford
,
Alcaria, Vicente
Year of Publication
04.03.2004
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Semiconductor chip carrier affording a high-density external interface
by
Portuondo, Maria
,
Crane
,
Stanford
Year of Publication
15.01.2004
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Modular architecture for high bandwidth computers
by
CRANE STANFORD
W
Year of Publication
15.01.2004
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High-density electrical interconnect system
by
CRANE STANFORD
W
Year of Publication
16.10.2003
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Optoelectronic packaging assembly
by
Horvath, Zsolt
,
Crane
,
Stanford
Year of Publication
06.03.2003
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Methode zur Herstellung eines Halbleiterchipträgers
by
CRANE
,
STANFORD
W
,
PORTUONDO, MARIA M
Year of Publication
12.02.2009
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Prefabricated semiconductor chip carrier
by
Portuondo, Maria
,
Crane
,
Stanford
Year of Publication
09.05.2002
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High-density electrical interconnect system
by
CRANE STANFORD
W
Year of Publication
07.03.2002
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Optoelectronic packaging assembly
by
CRANE STANFORD
W
,
HORVATH ZSOLT
Year of Publication
16.12.2004
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HALBLEITERCHIPTRÄGER
by
PORTUONDO, MARIA
,
CRANE
,
STANFORD
Year of Publication
09.12.1999
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OPTOELECTRONIC PACKAGING ASSEMBLY
by
HORVATH, ZSOLT
,
CRANE
,
STANFORD
, W
Year of Publication
13.03.2003
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Optoelectronic packaging assembly
by
CRANE STANFORD
W
,
HORVATH ZSOLT
Year of Publication
06.03.2003
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Prefabricated semiconductor chip carrier
by
PORTUONDO MARIA M
,
CRANE STANFORD
W.JR
Year of Publication
22.12.2005
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Die package for connection to a substrate
by
Jeon, Myoung-Soo
,
Crane
,
Stanford
,
Ogata, Charley
Year of Publication
25.11.2004
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Method of manufacturing a semiconductor die carrier
by
CRANE
,
STANFORD
, W., JR
,
PORTUONDO, MARIA, M
Year of Publication
20.02.2008
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