The effect of modifications to the nickel/gold surface finish on assembly quality and attachment reliability of a plastic ball grid array (peer review version)
Coyle, R.J., Popps, D.E.H., Mawer, A., Cullen, D.P., Wenger, G.M., Solan, P.P.
Published in IEEE transactions on components and packaging technologies (01.12.2003)
Published in IEEE transactions on components and packaging technologies (01.12.2003)
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Journal Article
Solder metallization interdiffusion in microelectronic interconnects
Zribi, A., Chromik, R.R., Presthus, R., Teed, K., Zavalij, L., DeVita, J., Tova, J., Cotts, E.J., Clum, J.A., Erich, R., Primavera, A., Westby, G., Coyle, R.J., Wenger, G.M.
Published in IEEE transactions on components and packaging technologies (01.06.2000)
Published in IEEE transactions on components and packaging technologies (01.06.2000)
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Journal Article
The effect of variations in nickel/gold surface finish on the assembly quality and attachment reliability of a plastic ball grid array
Coyle, R.J., Wenger, G.M., Hodges, D.E., Mawer, A., Cullen, D.P., Solan, P.P.
Published in 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) (2001)
Published in 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) (2001)
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Conference Proceeding
Solder joint attachment reliability and assembly quality of a molded ball grid array socket
Coyle, R.J., Holliday, A., Solan, P.P., Yao, C., Cyker, H.A., Manock, J.C., Bond, R., Stenerson, R.E., Furrow, R.G., Occhipinti, M.V., Gahr, S.A.
Published in 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) (2001)
Published in 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) (2001)
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Conference Proceeding
Delivery of high power laser beams in a distributed materials processing system
Coyle, R.J., Serafino, A.J., Grimes, G.J.
Published in Conference Proceedings. LEOS'98. 11th Annual Meeting. IEEE Lasers and Electro-Optics Society 1998 Annual Meeting (Cat. No.98CH36243) (1998)
Published in Conference Proceedings. LEOS'98. 11th Annual Meeting. IEEE Lasers and Electro-Optics Society 1998 Annual Meeting (Cat. No.98CH36243) (1998)
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Conference Proceeding
The influence of room temperature aging on ball shear strength and microstructure of area array solder balls
Coyle, R.J., Solan, P.P., Serafino, A.J., Gahr, S.A.
Published in 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) (2000)
Published in 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) (2000)
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Conference Proceeding
The influence of nickel/gold surface finish on the assembly quality and long term reliability of thermally enhanced BGA packages
Coyle, R.J., Holliday, A., Mescher, P., Solan, P.P., Gahr, S.A., Cyker, H.A., Dorey, K., Ejim, T.I.
Published in Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330) (1999)
Published in Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330) (1999)
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Conference Proceeding
Reliability performance and failure mode of high I/O thermally enhanced ball grid array packages
Coyle, R.J., Ejim, T.I., Holliday, A., Solan, P.P., Dorey, J.K.
Published in Twenty Third IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.98CH36205) (1998)
Published in Twenty Third IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.98CH36205) (1998)
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Conference Proceeding
Stability of welding techniques used in single-mode laser packages
Moyer, R.S., Lipson, J., German, M.G., Kaufman, S., Hall, P.M., Coyle, R.J.
Published in 38th Electronics Components Conference 1988., Proceedings (1988)
Published in 38th Electronics Components Conference 1988., Proceedings (1988)
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Conference Proceeding
Laser weld process improvements for optical isolator assembly
Kowalski, V.T., Coyle, R.J., Solan, P.P., Hogan, K.M.
Published in 1995 Proceedings. 45th Electronic Components and Technology Conference (1995)
Published in 1995 Proceedings. 45th Electronic Components and Technology Conference (1995)
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Conference Proceeding
Journal Article