The Influence of Processing on Strengthening Mechanisms in Pb-Free Solder Joints
Mutuku, Francis, Arfaei, Babak, Cotts, Eric J.
Published in Journal of electronic materials (01.04.2017)
Published in Journal of electronic materials (01.04.2017)
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Journal Article
The Failure of Sn-Bi-Based Solder Joints Due to Current Stressing
Hadian, Faramarz, Panta, Sitaram, Flores, Javier, Cotts, Eric J.
Published in Journal of electronic materials (01.02.2023)
Published in Journal of electronic materials (01.02.2023)
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Journal Article
Improving Copper Electrodeposition in the Microelectronics Industry
Yihua Liu, Liang Yin, Bliznakov, S., Kondos, P., Borgesen, P., Henderson, D.W., Parks, C., Ju Wang, Cotts, E.J., Dimitrov, N.
Published in IEEE transactions on components and packaging technologies (01.03.2010)
Published in IEEE transactions on components and packaging technologies (01.03.2010)
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Journal Article
The heat capacities of titanium silicides Ti5Si3, TiSi and TiSi2
AGARWAL, Shilpa, COTTS, Eric J, ZAREMBO, Sergei, KEMATICK, Robert, MYERS, Clifford
Published in Journal of alloys and compounds (16.01.2001)
Published in Journal of alloys and compounds (16.01.2001)
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Journal Article
Reliability Assessment and Microstructure Characterization of Cu Pillars Assembled on Si and Glass Substrates
Genanu, Mohammed, Mutuku, Francis, Cotts, Eric J., Perfecto, Eric, Pollard, Scott, Shorey, Aric, Arfaei, Babak
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
Vaporization thermodynamics and heat capacities of Cr3Ge and Cr5Ge3
ZAREMBO, Sergei N, MYERS, Clifford E, KEMATICK, Robert J, ZAVALIJ, Peter Y, WHITTINGHAM, M. Stanley, COTTS, Eric J
Published in Journal of alloys and compounds (14.11.2001)
Published in Journal of alloys and compounds (14.11.2001)
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Journal Article
Vaporization thermodynamics and heat capacities of Ti5Ge3 and Ti6Ge5
Zarembo, Sergei, Kematick, Robert J., Myers, Clifford E., Cotts, Eric J.
Published in Journal of alloys and compounds (23.06.2000)
Published in Journal of alloys and compounds (23.06.2000)
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Journal Article
Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints
Bieler, T.R., Hairong Jiang, Lehman, L.P., Kirkpatrick, T., Cotts, E.J., Nandagopal, B.
Published in IEEE transactions on components and packaging technologies (01.06.2008)
Published in IEEE transactions on components and packaging technologies (01.06.2008)
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Journal Article
Effects of reflow conditions on the formation of Au-Ni-Sn compounds at the interface of Au-Pb-Sn and Au-Sn solder joints with Ni substrate
Kinyanjui, R.K., Zribi, A., Cotts, E.J.
Published in 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) (2002)
Published in 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) (2002)
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Conference Proceeding
Linear coefficients of thermal expansion of Au0.5Ni0.5Sn4, Au0.75Ni0.25Sn4, and AuSn4
PITELY, Susan, ZAVALIJ, Lubov, ZAREMBO, Sergei, COTTS, Eric J
Published in Scripta materialia (01.10.2004)
Published in Scripta materialia (01.10.2004)
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Journal Article
Underflow process for direct-chip-attachment packaging
Lehmann, G.L., Driscoll, T., Guydosh, N.R., Li, P.C., Cotts, E.J.
Published in IEEE transactions on components, packaging, and manufacturing technology. Part A (01.06.1998)
Published in IEEE transactions on components, packaging, and manufacturing technology. Part A (01.06.1998)
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Journal Article
Examination of the utility of commercial-off-the-shelf memory devices as X-ray detectors
Fullem, T.Z., Lehman, L.P., Cotts, E.J.
Published in 2007 IEEE Nuclear Science Symposium Conference Record (01.10.2007)
Published in 2007 IEEE Nuclear Science Symposium Conference Record (01.10.2007)
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Conference Proceeding