Effect of Sample Size on the Solidification Temperature and Microstructure of SnAgCu Near Eutectic Alloys
Kinyanjui, R., Lehman, L.P., Zavalij, L., Cotts, E.
Published in Journal of materials research (01.11.2005)
Published in Journal of materials research (01.11.2005)
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Journal Article
Growth of Sn and intermetallic compounds in Sn-Ag-Cu solder
LEHMAN, L. P, ATHAVALE, S. N, XING, Y, ZAVALIJ, L, BORGESEN, P, COTTS, E. J, FULLEM, T. Z, GIAMIS, A. C, KINYANJUI, R. K, LOWENSTEIN, M, MATHER, K, PATEL, R, RAE, D, WANG, J
Published in Journal of electronic materials (01.12.2004)
Published in Journal of electronic materials (01.12.2004)
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Conference Proceeding
Journal Article
Grain-boundary character and grain growth in bulk tin and bulk lead-free solder alloys
TELANG, A. U, BIELER, T. R, LUCAS, J. P, SUBRAMANIAN, K. N, LEHMAN, L. P, XING, Y, COTTS, E. J
Published in Journal of electronic materials (01.12.2004)
Published in Journal of electronic materials (01.12.2004)
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Conference Proceeding
Journal Article
The growth of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu solder/Ni interfaces and the associated evolution of the solder microstructure
ZRIBI, A, CLARK, A, ZAVALIJ, L, BORGESEN, P, COTTS, E. J
Published in Journal of electronic materials (01.09.2001)
Published in Journal of electronic materials (01.09.2001)
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Conference Proceeding
Journal Article
Influence of plating parameters and solution chemistry on the voiding propensity at electroplated copper-solder interface
Liu, Y, Wang, J, Yin, L, Kondos, P, Parks, C, Borgesen, P, Henderson, D W, Cotts, E J, Dimitrov, N
Published in Journal of applied electrochemistry (01.12.2008)
Published in Journal of applied electrochemistry (01.12.2008)
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Journal Article
The microstructure of Sn in near-eutectic Sn–Ag–Cu alloy solder joints and its role in thermomechanical fatigue
Henderson, Donald W., Woods, James J., Gosselin, Timothy A., Bartelo, Jay, King, David E., Korhonen, T.M., Korhonen, M.A., Lehman, L.P., Cotts, E.J., Kang, Sung K., Lauro, Paul, Shih, Da-Yuan, Goldsmith, Charles, Puttlitz, Karl J.
Published in Journal of materials research (01.06.2004)
Published in Journal of materials research (01.06.2004)
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Journal Article
Improving the thermomechanical behavior of lead free solder joints by controlling the microstructure
Arfaei, B., Wentlent, L., Joshi, S., Alazzam, A., Tashtoush, T., Halaweh, M., Chivukula, S., Yin, L., Meilunas, M., Cotts, E., Borgesen, P.
Published in 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2012)
Published in 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2012)
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Conference Proceeding
Crystal structure of Au1-xNixSn4 intermetallic alloys
ZAVALIJ, L, ZRIBI, A, CHROMIK, R. R, PITELY, S, ZAVALIJ, P. Y, COTTS, E. J
Published in Journal of alloys and compounds (28.02.2002)
Published in Journal of alloys and compounds (28.02.2002)
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Journal Article
Linear coefficients of thermal expansion of Au0.5Ni0.5Sn4, Au0.75Ni0.25Sn4, and AuSn4
PITELY, Susan, ZAVALIJ, Lubov, ZAREMBO, Sergei, COTTS, Eric J
Published in Scripta materialia (01.10.2004)
Published in Scripta materialia (01.10.2004)
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Journal Article
Measurement of deformations in SnAgCu solder interconnects under in situ thermal loading
Park, Seungbae, Dhakal, Ramji, Lehman, Lawrence, Cotts, Eric
Published in Acta materialia (01.05.2007)
Published in Acta materialia (01.05.2007)
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