Impact of the national prevention policy and scrum law changes on the incidence of rugby-related catastrophic cervical spine injuries in French Rugby Union
Reboursiere, E, Bohu, Y, Retière, D, Sesboüé, B, Pineau, V, Colonna, J P, Hager, J P, Peyrin, J C, Piscione, J
Published in British journal of sports medicine (01.05.2018)
Published in British journal of sports medicine (01.05.2018)
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Journal Article
Er-doped light emitting slot waveguides monolithically integrated in a silicon photonic chip
Ramírez, J M, Ferrarese Lupi, F, Berencén, Y, Anopchenko, A, Colonna, J P, Jambois, O, Fedeli, J M, Pavesi, L, Prtljaga, N, Rivallin, P, Tengattini, A, Navarro-Urrios, D, Garrido, B
Published in Nanotechnology (22.03.2013)
Published in Nanotechnology (22.03.2013)
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Journal Article
Polarization strategies to improve the emission of Si-based light sources emitting at 1.55μm
Ramírez, J.M., Jambois, O., Berencén, Y., Navarro-Urrios, D., Anopchenko, A., Marconi, A., Prtljaga, N., Daldosso, N., Pavesi, L., Colonna, J.-P., Fedeli, J.-M., Garrido, B.
Published in Materials science & engineering. B, Solid-state materials for advanced technology (05.06.2012)
Published in Materials science & engineering. B, Solid-state materials for advanced technology (05.06.2012)
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Journal Article
Shaping circuit environment to face the thermal challenge Innovative technologies from low to high power electronics
Coudrain, P., Colonna, J.-P., Collin, L.-M., Prieto, R., Frechette, L.G., Barrau, J., Savelli, G., Vivet, P., Struss, Q., Widiez, J., Vladimirova, K., Triantopoulos, K., Beckrich-Ros, H., Vilarrubi, M., Laguna, G., Azarkish, H., Shirazi, M., Michailos, J.
Published in 2018 IEEE Symposium on VLSI Technology (01.06.2018)
Published in 2018 IEEE Symposium on VLSI Technology (01.06.2018)
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Conference Proceeding
Performance and Modeling of Si-Nanocrystal Double-Layer Memory Devices With High- k Control Dielectrics
Gay, G., Molas, G., Bocquet, M., Jalaguier, E., Gely, M., Masarotto, L., Colonna, J. P., Grampeix, H., Martin, F., Brianceau, P., Vidal, V., Kies, R., Baron, T., Ghibaudo, G., De Salvo, B.
Published in IEEE transactions on electron devices (01.04.2012)
Published in IEEE transactions on electron devices (01.04.2012)
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Journal Article
Double Si nanocrystal layers grown by RPCVD for non-volatile memory applications
Masarotto, L, Molas, G, Jalaguier, E, Gay, G, Colonna, J P, Hartmann, J M, Yckache, K
Published in Semiconductor science and technology (01.02.2011)
Published in Semiconductor science and technology (01.02.2011)
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Journal Article
Germanium thin film manufacturing using covalent bonding process
Abadie, K, Fournel, F, Morales, C, Mazen, F, Vignoud, L, Colonna, J-P, Widiez, J
Published in Semiconductor science and technology (01.04.2022)
Published in Semiconductor science and technology (01.04.2022)
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Journal Article
Evaluation of HfAlO high- k materials for control dielectric applications in non-volatile memories
Molas, G., Bocquet, M., Buckley, J., Grampeix, H., Gély, M., Colonna, J.P., Martin, F., Brianceau, P., Vidal, V., Bongiorno, C., Lombardo, S., Pananakakis, G., Ghibaudo, G., De Salvo, B., Deleonibus, S.
Published in Microelectronic engineering (01.12.2008)
Published in Microelectronic engineering (01.12.2008)
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Journal Article
Conference Proceeding
Erbium emission in MOS light emitting devices: from energy transfer to direct impact excitation
Ramírez, J M, Ferrarese Lupi, F, Jambois, O, Berencén, Y, Navarro-Urrios, D, Anopchenko, A, Marconi, A, Prtljaga, N, Tengattini, A, Pavesi, L, Colonna, J P, Fedeli, J M, Garrido, B
Published in Nanotechnology (30.03.2012)
Published in Nanotechnology (30.03.2012)
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Journal Article
Reliability of charge trapping memories with high- k control dielectrics (Invited Paper)
Molas, G., Bocquet, M., Vianello, E., Perniola, L., Grampeix, H., Colonna, J.P., Masarotto, L., Martin, F., Brianceau, P., Gély, M., Bongiorno, C., Lombardo, S., Pananakakis, G., Ghibaudo, G., De Salvo, B.
Published in Microelectronic engineering (01.07.2009)
Published in Microelectronic engineering (01.07.2009)
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Journal Article
Conference Proceeding
Thin micro-cold plate for hot-spot aware chip cooling
Collin, L.-M, Shirazy, Mahmood R. S., Colonna, J.-P, Coudrain, P., Cheramy, S., Souifi, A., Frechette, L. G.
Published in 2016 6th Electronic System-Integration Technology Conference (ESTC) (01.09.2016)
Published in 2016 6th Electronic System-Integration Technology Conference (ESTC) (01.09.2016)
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Conference Proceeding
Thermal measurements on flip-chipped system-on-chip packages with heat spreader integration
Prieto, R., Colonna, J. P., Coudrain, P., Santos, C., Vivet, P., Cheramy, S., Campos, D., Farcy, A., Avenas, Y.
Published in 2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) (01.03.2015)
Published in 2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) (01.03.2015)
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Conference Proceeding
Defects-induced gap states in hydrogenated γ-alumina used as blocking layer for non-volatile memories
Masoero, L., Blaise, P., Molas, G., Colonna, J.P., Gély, M., Barnes, J.P., Ghibaudo, G., De Salvo, B.
Published in Microelectronic engineering (01.07.2011)
Published in Microelectronic engineering (01.07.2011)
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Journal Article
Conference Proceeding
Towards efficient and reliable 300mm 3D technology for wide I/O interconnects
Coudrain, P., Colonna, J.-P, Aumont, C., Garnier, G., Chausse, P., Segaud, R., Vial, K., Jouve, A., Mourier, T., Magis, T., Besson, P., Gabette, L., Brunet-Manquat, C., Allouti, N., Laviron, C., Cheramy, S., Saugier, E., Pruvost, J., Farcy, A., Hotellier, N.
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
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Conference Proceeding
New challenges and opportunities for 3D integrations
Michailos, J., Coudrain, P., Farcy, A., Hotellier, N., Cheramy, S., Lhostis, S., Deloffre, E., Sanchez, Y., Jouve, A., Guyader, F., Saugier, E., Fiori, V., Vivet, P., Vinet, M., Fenouillet-Beranger, C., Casset, F., Batude, P., Breuf, F., Henrion, Y., Vianne, B., Collin, L.-M, Colonna, J.-P, Benaissa, L., Brunet, L., Prieto, R., Velard, R., Ponthenier, F.
Published in 2015 IEEE International Electron Devices Meeting (IEDM) (01.12.2015)
Published in 2015 IEEE International Electron Devices Meeting (IEDM) (01.12.2015)
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Conference Proceeding
Journal Article
Investigation of charge-trap memories with AlN based band engineered storage layers
Molas, G., Colonna, J.P., Kies, R., Belhachemi, D., Bocquet, M., Gély, M., Vidal, V., Brianceau, P., Martinez, E., Papon, A.M., Licitra, C., Vandroux, L., Ghibaudo, G., De Salvo, B.
Published in Solid-state electronics (01.04.2011)
Published in Solid-state electronics (01.04.2011)
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Journal Article
Impact of a HTO/Al2O3 bi-layer blocking oxide in nitride-trap non-volatile memories
BOCQUET, M, MOLAS, G, TOFFOLI, A, DELEONIBUS, S, GHIBAUDO, G, PANANAKAKIS, G, DE SALVO, B, PERNIOLA, L, GARROS, X, BUCKLEY, J, GELY, M, COLONNA, J. P, GRAMPEIX, H, MARTIN, F, VIDAL, V
Published in Solid-state electronics (01.07.2009)
Published in Solid-state electronics (01.07.2009)
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Conference Proceeding
Journal Article
Thermal correlation between measurements and FEM simulations in 3D ICs
Souare, P. M., de Crecy, F., Fiori, V., Ben Jamaa, H., Farcy, A., Gallois-Garreignot, S., Borbely, A., Colonna, J.-P, Coudrain, P., Giraud, B., Laviron, C., Cheramy, S., Tavernier, C., Michailos, J.
Published in 2013 IEEE International 3D Systems Integration Conference (3DIC) (01.10.2013)
Published in 2013 IEEE International 3D Systems Integration Conference (3DIC) (01.10.2013)
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Conference Proceeding
Direct probing of trapped charge dynamics in SiN by Kelvin Force Microscopy
Vianello, E, Nowak, E, Mariolle, D, Chevalier, N, Perniola, L, Molas, G, Colonna, J P, Driussi, F, Selmi, L
Published in 2010 International Conference on Microelectronic Test Structures (ICMTS) (01.03.2010)
Published in 2010 International Conference on Microelectronic Test Structures (ICMTS) (01.03.2010)
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Conference Proceeding
Thermal performance of CoolCube™ monolithic and TSV-based 3D integration processes
Santos, C., Vivet, P., Thuries, S., Billoint, O., Colonna, J.-P, Coudrain, P., Wang, L.
Published in 2016 IEEE International 3D Systems Integration Conference (3DIC) (01.11.2016)
Published in 2016 IEEE International 3D Systems Integration Conference (3DIC) (01.11.2016)
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Conference Proceeding