Method of forming a flip-chip package
GAYNES MICHAEL A, COFFIN JEFFREY T, SIKKA KAMAL K, QUESTAD DAVID L, WAKIL JAMIL A, TOY HILTON T
Year of Publication 18.10.2011
Get full text
Year of Publication 18.10.2011
Patent
Method of forming a flip-chip package
Coffin, Jeffrey T, Gaynes, Michael A, Questad, David L, Sikka, Kamal K, Toy, Hilton T, Wakil, Jamil A
Year of Publication 18.10.2011
Get full text
Year of Publication 18.10.2011
Patent
Method for assembling a carrier and a semiconductor device
Brofman, Peter J, Call, Anson J, Coffin, Jeffrey T, Stalter, Kathleen A
Year of Publication 01.07.2003
Get full text
Year of Publication 01.07.2003
Patent
Capping structure for electronics package undergoing compressive socket actuation
Coffin, Jeffrey T, Ellsworth, Jr., Michael J, Goldmann, Lewis S, Torok, John G
Year of Publication 08.10.2002
Get full text
Year of Publication 08.10.2002
Patent
Capping structure for electronics package undergoing compressive socket actuation
COFFIN JEFFREY T, ELLSWORTH, JR. MICHAEL J, GOLDMANN LEWIS S, TOROK JOHN G
Year of Publication 08.10.2002
Get full text
Year of Publication 08.10.2002
Patent
Capping structure for electronics package undergoing compressive socket actuation
COFFIN JEFFREY T, GOLDMANN LEWIS S, ELLSWORTH MICHAEL J, TOROK JOHN G
Year of Publication 27.06.2002
Get full text
Year of Publication 27.06.2002
Patent
Ceramic packages for liquid-nitrogen operation
Tong, H.-M., Yeh, H.L., Goldblatt, R.D., Srivastava, K.K., Coffin, J.T., Rosenberg, W.D., Jaspal, J.S.
Published in IEEE transactions on electron devices (01.08.1989)
Published in IEEE transactions on electron devices (01.08.1989)
Get full text
Journal Article