Reactions of Sn-3.5Ag-Based Solders Containing Zn and Al Additions on Cu and Ni(P) Substrates
Kotadia, H. R., Mokhtari, O., Bottrill, M., Clode, M. P., Green, M. A., Mannan, S. H.
Published in Journal of electronic materials (01.12.2010)
Published in Journal of electronic materials (01.12.2010)
Get full text
Journal Article
Comparison of interfacial reactions of Ni and Ni–P in extended contact with liquid Sn–Bi-based solders
Li, J.F., Mannan, S.H., Clode, M.P., Chen, K., Whalley, D.C., Liu, C., Hutt, D.A.
Published in Acta materialia (2007)
Published in Acta materialia (2007)
Get full text
Journal Article
Dissolution and interfacial reaction of Nb in contact with the molten 52In–48Sn solder
Li, J.F., Mannan, S.H., Clode, M.P., Johnston, C., Crossley, A.
Published in Acta materialia (01.09.2007)
Published in Acta materialia (01.09.2007)
Get full text
Journal Article
Benefits of Wheel-Tool Gap Sensing in Conform™ Extrusion Machinery
Khawaja, K, Seneviratne, L, Clode, M P
Published in IEEE/ASME transactions on mechatronics (01.08.2005)
Published in IEEE/ASME transactions on mechatronics (01.08.2005)
Get full text
Journal Article
Disabling of Nanoparticle Effects at Increased Temperature in Nanocomposite Solders
Mokhtari, Omid, Roshanghias, Ali, Ashayer, Roya, Kotadia, Hiren R., Khomamizadeh, Farzad, Kokabi, Amir H., Clode, Michael P., Miodownik, Mark, Mannan, Samjid H.
Published in Journal of electronic materials (01.07.2012)
Published in Journal of electronic materials (01.07.2012)
Get full text
Journal Article
Benefits of wheel-tool gap sensing in Conform/spl trade/ extrusion machinery
Khawaja, K., Seneviratne, L., Clode, M.P.
Published in IEEE/ASME transactions on mechatronics (01.08.2005)
Published in IEEE/ASME transactions on mechatronics (01.08.2005)
Get full text
Journal Article
Interactions between liquid Sn-Bi based solders and contact metals for high temperature applications
Li, J.F., Mannan, S.H., Clode, M.P., Lobato, H.M., Liu, C., Whalley, D.C., Lawrence, F.T., Jackson, G., Steen, H.
Published in Proceedings Electronic Components and Technology, 2005. ECTC '05 (2005)
Published in Proceedings Electronic Components and Technology, 2005. ECTC '05 (2005)
Get full text
Conference Proceeding
Cross-Section Preparation for Solder Joints and MEMS Device Using Argon Ion Beam Milling
Amirmajdi, O.M., Ashyer-Soltani, R., Clode, M.P., Mannan, S.H., Yunqi Wang, Cabruja, E., Pellegrini, G.
Published in IEEE transactions on electronics packaging manufacturing (01.10.2009)
Published in IEEE transactions on electronics packaging manufacturing (01.10.2009)
Get full text
Journal Article