by Maxey, K., Naylor, C. H., O'Brien, K. P., Penumatcha, A., Oni, A., Mokhtarzadeh, C., Dorow, C. J., Rogan, C., Holybee, B., Tronic, T., Adams, D., Arefin, N., Sen Gupta, A., Lin, C.-C., Zhong, T., Lee, S., Kitamura, A., Bristol, R., Clendenning, S. B., Avci, U., Metz, M.
Published in 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (12.06.2022)

by Naylor, C. H., Maxey, K., Jezewski, C., O'Brien, K. P., Penumatcha, A. V., Kavrik, M. S., Agrawal, B., Littlefield, C. V., Lux, J., Barley, B., Weber, J. R., Gupta, A. Sen, Dorow, C. J., Arefin, N., King, S., Chebiam, R., Plombon, J., Clendenning, S. B., Avci, U. E., Kobrinsky, M., Metz, M.
Published in 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (11.06.2023)

by Clendenning, S. B., Aouba, S., Rayat, M. S., Grozea, D., Sorge, J. B., Brodersen, P. M., Sodhi, R. N. S., Lu, Z.-H., Yip, C. M., Freeman, M. R., Ruda, H. E., Manners, I.
Published in Advanced materials (Weinheim) (03.02.2004)

by O'Brien, K. P., Dorow, C. J., Penumatcha, A., Maxey, K., Lee, S., Naylor, C. H., Hsiao, A., Holybee, B., Rogan, C., Adams, D., Tronic, T., Ma, S., Oni, A., Gupta, A. Sen, Bristol, R., Clendenning, S., Metz, M., Avci, U.
Published in 2021 IEEE International Electron Devices Meeting (IEDM) (01.01.2021)

by Huang, C. -Y., Dewey, G., Mannebach, E., Phan, A., Morrow, P., Rachmady, W., Tung, I. -C., Thomas, N., Alaan, U., Paul, R., Kabir, N., Krist, B., Oni, A., Mehta, M., Harper, M., Nguyen, P., Keech, R., Vishwanath, S., Cheong, K. L., Kang, J. S., Lilak, A., Metz, M., Clendenning, S., Turkot, B., Schenker, R., Yoo, H. J., Radosavljevic, M., Kavalieros, J.
Published in 2020 IEEE International Electron Devices Meeting (IEDM) (12.12.2020)

by Dorow, C. J., Penumatcha, A., Kitamura, A., Rogan, C., O'Brien, K. P., Lee, S., Ramamurthy, R., Cheng, C. -Y., Maxey, K., Zhong, T., Tronic, T., Holybee, B., Richards, J., Oni, A., Lin, C. -C., Naylor, C. H., Arefin, N., Metz, M., Bristol, R., Clendenning, S. B., Avci, U.
Published in 2022 International Electron Devices Meeting (IEDM) (03.12.2022)

by Clendenning, S. B., Han, S., Coombs, N., Paquet, C., Rayat, M. S., Grozea, D., Brodersen, P. M., Sodhi, R. N. S., Yip, C. M., Lu, Z.-H., Manners, I.
Published in Advanced materials (Weinheim) (17.02.2004)

by Radosavljevic, M., Huang, C.-Y., Rachmady, W., Seung, S.H., Thomas, N. K., Dewey, G., Agrawal, A., Owens, K., Kuo, C. C., Jezewski, C. J., Nahm, R., Briggs, N., Tronic, T. A., Michaelos, T., Kabir, N. A., Holybee, B., Jun, K., Morrow, P., Phan, A., Shivaraman, S., Then, H. W., Kapinus, V., Harper, M. K., Nguyen, P. D., Cheong, K. L., Ghose, S., Ganguly, K., Bomberger, C., Tan, J. M., El Qader, M. Abd, Oni, A. A., Fischer, P., Bristol, R., Metz, M., Clendenning, S. B., Turkot, B., Schenker, R., Kobrinsky, M. J., Kavalieros, J.
Published in 2021 IEEE International Electron Devices Meeting (IEDM) (11.12.2021)

by Vlaar, Mark J. M., Ehlers, Andreas W., Schakel, Marius, Clendenning, Scott B., Nixon, John F., Lutz, Martin, Spek, Anthony L., Lammertsma, Koop
Published in Chemistry : a European journal (17.08.2001)

by Mortelmans, W., Buragohain, P., Rogan, C., Kitamura, A., Dorow, C.J., O'Brien, K.P., Ramamurthy, R., Lux, J., Zhong, T., Harlson, S., Gillispie, E., Wilson, T., Oni, A., Penumatcha, A., Kavrik, M., Maxey, K., Kozhakhmetov, A., Lin, C-C., Lee, S., Vyatskikh, A., Arefin, N., Fischer, P., Kevek, J., Tronic, T., Metz, M., Clendenning, S., Avci, U.
Published in 2024 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (16.06.2024)

by Long, B., Alessio Verni, G., O’Connell, J., Shayesteh, M., Gangnaik, A., Georgiev, Y.M., Carolan, P., O’Connell, D., Kuhn, K.J., Clendenning, S.B., Nagle, R., Duffy, R., Holmes, J.D.
Published in Materials science in semiconductor processing (01.05.2017)

by Dorow, C. J., O'Brien, K. P., Naylor, C. H., Lee, S., Penumatcha, A., Hsiao, A., Tronic, T., Christenson, M., Maxey, K., Zhu, H., Oni, A., Alaan, U. S., Gosavi, T. A., Gupta, A. Sen, Bristol, R., Clendenning, S., Metz, M., Avci, U. E.
Published in 2021 Symposium on VLSI Technology (13.06.2021)

by Vidjayacoumar, Balamurugan, Ramalingam, Venkateswaran, Emslie, David J. H., Blackwell, James, Clendenning, Scott
Published in ECS transactions (15.03.2013)

by Provias, A., Knobloch, T., Kitamura, A., O'Brien, K. P., Dorow, C. J., Waldhoer, D., Stampfer, B., Penumatcha, A. V., Lee, S., Ramamurthy, R., Clendenning, S., Waltl, M., Avci, U., Grasser, T.
Published in 2023 International Electron Devices Meeting (IEDM) (09.12.2023)

by Clark, Timothy J., Rodezno, José M., Clendenning, Scott B., Aouba, Stephane, Brodersen, Peter M., Lough, Alan J., Ruda, Harry E., Manners, Ian
Published in Chemistry : a European journal (18.07.2005)

by Jaska, Cory A, Clark, Timothy J, Clendenning, Scott B, Grozea, Dan, Turak, Ayse, Lu, Zheng-Hong, Manners, Ian
Published in Journal of the American Chemical Society (13.04.2005)

by Chan, Wing Yan, Clendenning, Scott B, Berenbaum, Andrea, Lough, Alan J, Aouba, Stephane, Ruda, Harry E, Manners, Ian
Published in Journal of the American Chemical Society (16.02.2005)

by Chan, Wing Yan, Berenbaum, Andrea, Clendenning, Scott B, Lough, Alan J, Manners, Ian
Published in Organometallics (15.09.2003)

by Gardner, D. S., Holzwarth, C. W., Liu, Y., Clendenning, S. B., Jin, W., Moon, B. K., Pint, C., Chen, Z., Hannah, E., Chen, R., Wang, C. P., Chen, C., Makila, E., Gustafson, J. L.
Published in 2014 IEEE International Electron Devices Meeting (01.12.2014)

by Greenberg, Sharonna, Clendenning, Scott B, Liu, Kun, Manners, Ian, Aouba, Stéphane, Ruda, Harry E
Published in Macromolecules (22.03.2005)