Gold-Aluminum Intermetallics: Ball Bond Shear Testing and Thin Film Reaction Couples
Clatterbaugh, G., Weiner, J., Charles, H.
Published in IEEE transactions on components, hybrids, and manufacturing technology (01.12.1984)
Published in IEEE transactions on components, hybrids, and manufacturing technology (01.12.1984)
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Journal Article
Conference Proceeding
Ultra-thin flexible microcircuit assemblies using thinned die and multilayer thin-film substrates
Francomacaro, A.S., Charles, H.K., Lehtonen, S.J., Keeney, A.C., Clatterbaugh, G.V., Banda, C.V.
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
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Conference Proceeding