Identify critical packaging parameters impacting wafer warpage using FEA and statistical analysis techniques
Lin, Ji, Chyn, Ng Yong
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Parasitic Surface Conduction Effect of TSV on Interconnection Performance in RF SOI for 2.5D Integration
Lin, Zhou, Guan, Lim Teck, Jiaqi, Wu, Feng, Xu, Chinq, Jong Ming, Chyn, Ng Yong
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Indium-based Flip-chip Interconnect for Cryogenic Packaging
Jaafar, Norhanani Binte, Hongyu, Li, Choong, Chong Ser, Yong Chyn, Ng, Huang, Ding, Lau, Chit Siong, Goh, Kuan Eng Johnson, Chui, King-Jien
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Investigation of SnAg Superconductivity as Solder Material for Cryogenic Packaging
Ng, Yong Chyn, Li, Hongyu, Jaafar, Norhanani Binte, Cheow Siong Lee, Rainer, Huang, Ding, Lau, Chit Siong, Eng Johnson Goh, Kuan, Chui, King-Jien
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Design and Fabrication of 2.5D Cryogenic Interposer With Integrated Superconducting TSVs and Resonators
Li, HongYu, Chui, King-Jien, Kiat Goh, Simon Chun, Perdana Budoyo, Rangga, Long, Nguyen Hoang, Chyn Ng, Yong, Lau, Daniel, Jaafar, B. N., Paul Tan, Yuanzheng, Dumke, Rainer
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Demonstration of a CMOS-Compatible Superconducting Cryogenic Interposer for Advanced Quantum Processors
Chui, King-Jien, Li, Hongyu, Ng, Yong Chyn, Lau, Chit Siong, Goh, K. E. J., Huang, D., Tseng, Ya-Ching, Chen, J. K., Yu, H., Jaafar, B. N., Lin, H., Varghese, B.
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
High-Performance Amplifier Package Design for Heterogenous Integration on Si-interposer
Lim, Teck Guan, Zho, Lin, Tippabhotla, Sasi Kumar, Lin, Ji, Chinq, Jong Ming, Wu, JiaQi, Gongyue, Tang, Ching, Eva Wai Leong, Ng, Yong Chyn, Chui, King Jien, Lu, Wei Jia, Goh, Chee Heng, Lin Pek, Sek, Loh, Jun Wei Agnes
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
Automated Analysis of AFM Data of High-Density Cu Pad for Fine Pitch Wafer-to-Wafer (W2W) and Chip-to-Wafer (C2W) Hybrid Bonding
Chen, Jiakai, Ng, Yong Chyn, Mishra, Dileep K., Chui, K. J.
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
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Conference Proceeding