Semiconductor package and method for fabricating a semiconductor package
Chong, Hock Heng, Ng, Mei Chin, Pok, Pei Luan, Fang, Chee Hong, Ng, Yean Seng, Chiang, Chau Fatt, Muhammad, Muhammat Sanusi, Chung, Khar Foong, Wang, Choon Huey, Chan, Sook Woon
Year of Publication 26.11.2019
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Year of Publication 26.11.2019
Patent
Semiconductor package and method for fabricating a semiconductor package
NG, Yean Seng, MUHAMMAD, Muhammat Sanusi, CHAN, Sook Woon, POK, Pei Luan, WANG, Choon Huey, CHIANG, Chau Fatt, CHUNG, Khar Foong, NG, Mei Chin, FANG, Chee Hong, CHONG, Hock Heng
Year of Publication 21.06.2018
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Year of Publication 21.06.2018
Patent
HALBLEITER-PACKAGE UND VERFAHREN ZUM FERTIGEN EINES HALBLEITER-PACKAGE
Chong, Hock Heng, Ng, Mei Chin, Pok, Pei Luan, Fang, Chee Hong, Ng, Yean Seng, Chiang, Chau Fatt, Muhammad, Muhammat Sanusi, Chung, Khar Foong, Wang, Choon Huey, Chan, Sook Woon
Year of Publication 14.06.2018
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Year of Publication 14.06.2018
Patent