by Budiman, A.S., Shin, H.-A.-S., Kim, B.-J., Hwang, S.-H., Son, H.-Y., Suh, M.-S., Chung, Q.-H., Byun, K.-Y., Tamura, N., Kunz, M., Joo, Y.-C.
Published in Microelectronics and reliability (01.03.2012)

by Coates, Alison, Chung, Alexander Q.H., Lessard, Lysanne, Grudniewicz, Agnes, Espadero, Cathryn, Gheidar, Yasaman, Bemgal, Sampath, Da Silva, Emily, Sauré, Antoine, King, James, Fung-Kee-Fung, Michael
Published in International journal of medical informatics (Shannon, Ireland) (01.10.2023)

by Chung, Alexander Q.H., Andreev, Pavel, Benyoucef, Morad, Duane, Aidan, O’Reilly, Philip
Published in International journal of information management (01.02.2017)

by Chung, Alexander Q.H., Andreev, Pavel, Benyoucef, Morad, Duane, Aidan, O’Reilly, Philip
Published in International journal of information management (01.08.2018)

by Budiman, A. S., Shin, H., Kim, B.-J, Hwang, S.-H, Son, H.-Y, Suh, M.-S, Chung, Q.-H, Byun, K.-Y, Joo, Y.-C, Caramto, R., Smith, L., Kunz, M., Tamura, N.
Published in 2012 IEEE International Interconnect Technology Conference (01.06.2012)

by HERRANZ, C, CHEN, Y, CHUNG, H.-J, CINTAS, L. M, HERNANDEZ, P. E, MONTVILLE, T. J, CHIKINDAS, M. L
Published in Applied and environmental microbiology (01.04.2001)

by Jeon, Insu, Chung, Qwanho
Published in Microelectronics and reliability (01.12.2003)

by Insu Jeon, Qwanho Chung, Joonki Hong, Kwangyoo Byun
Published in Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506) (2001)

by ZHOU JIN L.,ZHAO XIAN G.,LAM CHIN H.,CUI ZHI Q.,CHUNG KOON F
Year of Publication 01.11.2006