Technological sustainable materials and enabling in semiconductor memory industry: A review
Gan, Chong Leong, Chung, Min-Hua, Zou, Yung-Sheng, Huang, Chen-Yu, Takiar, Hem
Published in e-Prime (01.09.2023)
Published in e-Prime (01.09.2023)
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Journal Article
Evolution of epoxy molding compounds and future carbon materials for thermal and mechanical stress management in memory device packaging: a critical review
Gan, Chong Leong, Chung, Min-Hua, Lin, Lu-Fu, Huang, Chen-Yu, Takiar, Hem
Published in Journal of materials science. Materials in electronics (01.10.2023)
Published in Journal of materials science. Materials in electronics (01.10.2023)
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Journal Article
Case study of large-scale levee failures induced by cyclic softening of clay during the 2016 Meinong earthquake
Tsai, Chi-Chin, Yang, Zi-Xian, Chung, Min-Hua, Hsu, Shang-Yi
Published in Engineering geology (01.02.2022)
Published in Engineering geology (01.02.2022)
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Journal Article
Solder joint reliability performance study and shear characterization of low-Ag SAC lead-free solders for handheld application
Liu, Vance, Zou, Yung-Sheng, Chen, Yi-Yu, Chang, Wan Ling, Foo, Xue Qin, Chen, Yi-Jing, Chen, Chien-Ming, Chung, Min-Hua, Gan, Chong Leong
Published in Materials science in semiconductor processing (15.08.2024)
Published in Materials science in semiconductor processing (15.08.2024)
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Journal Article
Tombstoning Investigation of Ultra-small Chip Passive Components on eMMC Products
Hsu, Yun-Ting, Zou, Yung-Sheng, Chung, Min-Hua, Gan, Chong-Leong, Venkatraman, Venkatesh, Paul, Anila, Low, Winnie, Che, Faxing
Published in 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (24.07.2023)
Published in 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (24.07.2023)
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Conference Proceeding
Investigation of Bi and In Elemental Addition in Solder Paste for DRAM Module Reliability Enhancement
Hsu, Yun-Ting, Zou, Yung-Sheng, Chen, Yi-Yu, Chung, Min-Hua, Gan, Chong-Leong, Macalalad, Fatima, Subramanian, Shriram Harihara
Published in 2023 International Conference on Electronics Packaging (ICEP) (19.04.2023)
Published in 2023 International Conference on Electronics Packaging (ICEP) (19.04.2023)
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Conference Proceeding
Silane modification on mesoporous silica coated carbon nanotubes for improving compatibility and dispersity in epoxy matrices
Chung, Min-Hua, Wang, Wei-Hsiang, Chen, Li-Ming, Lee, Chiu-Wen, Yang, Ping-Feng, Liao, Yen-Sen, Lin, Hong-Ping
Published in Composites. Part A, Applied science and manufacturing (01.11.2015)
Published in Composites. Part A, Applied science and manufacturing (01.11.2015)
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Journal Article
Effects of mesoporous silica coated multi-wall carbon nanotubes on the mechanical and thermal properties of epoxy nanocomposites
Chung, Min-Hua, Chen, Li-Ming, Wang, Wei-Hsiang, Lai, Yishao, Yang, Ping-Feng, Lin, Hong-Ping
Published in Journal of the Taiwan Institute of Chemical Engineers (01.09.2014)
Published in Journal of the Taiwan Institute of Chemical Engineers (01.09.2014)
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Journal Article
Development of Novel Fine Line 2.1 D Package with Organic Interposer Using Advanced Substrate-Based Process
Wei-Chung Chen, Chiu-Wen Lee, Hung-Chun Kuo, Min-Hua Chung, Chaung-Chi Wang, Shang-Kun Huang, Yen-Sen Liao, Chen-Chao Wang, Tarng, David
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
Novel ultra-fine line 2.1D package with organic interposer
Wei-Chung Chen, Chiu-Wen Lee, Min-Hua Chung, Chuang-Chi Wang, Shang-Kun Huang, Yen-Sen Liao
Published in 2017 IEEE CPMT Symposium Japan (ICSJ) (01.11.2017)
Published in 2017 IEEE CPMT Symposium Japan (ICSJ) (01.11.2017)
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Conference Proceeding
Investigation of mesoporous silica coated multi-wall carbon nanotubes on the mechanical and thermal properties of epoxy nanocomposites
Min-Hua Chung, Ping-Feng Yang, Chiu-Wen Lee, Chih-Ping Hung, Hong-Ping Lin
Published in 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2014)
Published in 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2014)
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Conference Proceeding
Synthesis and characterization of polydopamine modified carbon nanotube (CNT)/polydimethylsiloxane (PDMS) composites
Chih-Feng Wang, Pei-Kang Huang, Pei-Rung Hung, Chan-Chih Hsu, Sheng-Rui Jian, Ping-Feng Yang, Min-Hua Chung
Published in 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) (01.04.2015)
Published in 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) (01.04.2015)
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Conference Proceeding
Effectiveness of Slow Cure Non-Conductive Film in Void elimination
Jao, Li, Lai, Ming Hung, Kr, Sareddy, Tsai, Meng Hung, Espina, Angelo, Chung, Min Hua, Gan, Chong Leong
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
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Conference Proceeding
RADIATION PROTECTION FOR SEMICONDUCTOR DEVICES AND ASSOCIATED SYSTEMS AND METHODS
Zou, Yung Sheng, Chung, Min Hua, Gan, Chong Leong, Lin, Lu Fu, Jao, Li
Year of Publication 02.03.2023
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Year of Publication 02.03.2023
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