Designing and Modeling for Power Integrity
Swaminathan, Madhavan, Daehyun Chung, Grivet-Talocia, Stefano, Bharath, Krishna, Laddha, Vishal, Jianyong Xie
Published in IEEE transactions on electromagnetic compatibility (01.05.2010)
Published in IEEE transactions on electromagnetic compatibility (01.05.2010)
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Journal Article
Rigorous Electrical Modeling of Through Silicon Vias (TSVs) With MOS Capacitance Effects
Bandyopadhyay, T, Ki Jin Han, Daehyun Chung, Chatterjee, R, Swaminathan, M, Tummala, R
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.06.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.06.2011)
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Journal Article
A Three-Dimensional Stacked-Chip Star-Wiring Interconnection for a Digital Noise-Free and Low-Jitter I/O Clock Distribution Network
RYU, Chunghyun, CHUNG, Daehyun, LEE, Choonheung, KIM, Jinhan, BAE, Kicheol, YU, Jiheon, LEE, Seungjae, KIM, Joungho
Published in IEEE microwave and wireless components letters (01.12.2006)
Published in IEEE microwave and wireless components letters (01.12.2006)
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Journal Article
Diarctigenin, a Lignan Constituent from Arctium lappa , Down-Regulated Zymosan-Induced Transcription of Inflammatory Genes through Suppression of DNA Binding Ability of Nuclear Factor-κB in Macrophages
Kim, Byung Hak, Hong, Seong Su, Kwon, Soon Woo, Lee, Hwa Young, Sung, Hyeran, Lee, In-Jeong, Hwang, Bang Yeon, Song, Sukgil, Lee, Chong-Kil, Chung, Daehyun, Ahn, Byeongwoo, Nam, Sang-Yoon, Han, Sang-Bae, Kim, Youngsoo
Published in The Journal of pharmacology and experimental therapeutics (01.11.2008)
Published in The Journal of pharmacology and experimental therapeutics (01.11.2008)
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Journal Article
Chip-package hybrid clock distribution network and DLL for low jitter clock delivery
Daehyun Chung, Chunghyun Ryu, Hyungsoo Kim, Choonheung Lee, Jinhan Kim, Kicheol Bae, Jiheon Yu, Hoijun Yoo, Kim, Joungho
Published in IEEE journal of solid-state circuits (01.01.2006)
Published in IEEE journal of solid-state circuits (01.01.2006)
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Journal Article
Conference Proceeding
Electrical modeling of Through Silicon and Package Vias
Bandyopadhyay, T., Chatterjee, R., Daehyun Chung, Swaminathan, M., Tummala, R.
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
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Conference Proceeding
Simultaneous switching noise model by distributed power port and ground current capture
Seunghyun Hwang, Daehyun Chung, Satagopan, Venkat, Sudhakaran, Sunil, Lin, Daniel, Moghadam, Fathi
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding
A chip-package hybrid DLL loop and clock distribution network for low-jitter clock delivery
Daehyun Chung, Chunghyun Ryu, Hyungsoo Kim, Choonheung Lee, Jaedong Kim, Jinyoung Kim, Kicheol Bae, Jiheon Yu, Seungjae Lee, Hoijun Yoo, Kim, Joungho
Published in ISSCC. 2005 IEEE International Digest of Technical Papers. Solid-State Circuits Conference, 2005 (2005)
Published in ISSCC. 2005 IEEE International Digest of Technical Papers. Solid-State Circuits Conference, 2005 (2005)
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Conference Proceeding
Electrical modeling of annular and co-axial TSVs considering MOS capacitance effects
Bandyopadhyay, T., Chatterjee, R., Daehyun Chung, Swaminathan, M., Tummala, R.
Published in 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2009)
Published in 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2009)
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Conference Proceeding
Achieving near zero SSN power delivery networks by eliminating power planes and using constant current power transmission lines
Huh, S., Daehyun Chung, Swaminathan, M.
Published in 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2009)
Published in 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2009)
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Conference Proceeding
Near-Field and Far-Field Analyses of Alternating Impedance Electromagnetic Bandgap (AI-EBG) Structure for Mixed-Signal Applications
Jinwoo Choi, Dong Gun Kam, Daehyun Chung, Srinivasan, K., Govind, V., Joungho Kim, Swaminathan, M.
Published in IEEE transactions on advanced packaging (01.05.2007)
Published in IEEE transactions on advanced packaging (01.05.2007)
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Journal Article
Electrical-thermal co-analysis for power delivery networks in 3D system integration
Jianyong Xie, Daehyun Chung, Swaminathan, M., Mcallister, M., Deutsch, A., Lijun Jiang, Rubin, B.J.
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
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Conference Proceeding
Filter integration in ultra thin organic substrate via 3D stitched capacitor
Sunghwan Min, Seunghyun Hwang, Daehyun Chung, Swaminathan, M., Sridharan, V., Chan, H., Fuhan Liu, Sundaram, V., Tummala, R.R.
Published in 2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) (01.12.2009)
Published in 2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) (01.12.2009)
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Conference Proceeding
Effect of system components on electrical and thermal characteristics for power delivery networks in 3D system integration
Jianyong Xie, Daehyun Chung, Swaminathan, M., Mcallister, M., Deutsch, A., Lijun Jiang, Rubin, B.J.
Published in 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2009)
Published in 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2009)
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Conference Proceeding
A novel synthesis method for designing electromagnetic band gap (EBG) structures in packaged mixed signal systems
Tae Hong Kim, Daehyun Chung, Ege Engin, Wansuk Yun, Toyota, Y., Swaminathan, M.
Published in 56th Electronic Components and Technology Conference 2006 (2006)
Published in 56th Electronic Components and Technology Conference 2006 (2006)
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Conference Proceeding
Effect of EBG Structures for Reducing Noise in Multi-Layer PCBs for Digital Systems
Daehyun Chung, Tae Hong Kim, Chunghyun Ryu, Engin, E., Swaminathan, M., Joungho Kim
Published in 2006 IEEE Electrical Performane of Electronic Packaging (01.10.2006)
Published in 2006 IEEE Electrical Performane of Electronic Packaging (01.10.2006)
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Conference Proceeding
Near field and far field analysis of alternating impedance electromagnetic bandgap (AI-EBG) structure for mixed-signal applications
Jinwoo Choi, Dong Gun Kam, Daehyun Chung, Srinivasan, K., Govind, V., Kim, Joungho, Swaminathan, M.
Published in IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005 (2005)
Published in IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005 (2005)
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Conference Proceeding
Compensation of ESD and input capacitance effect by using package bondwire inductance for over Gbps differential SerDes devices
Seungyoung Ahn, Jongbae Park, Daehyun Chung, Kim, Joungho
Published in Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) (2003)
Published in Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) (2003)
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Conference Proceeding