Signal and Power Integrity Analysis of A 0.38 pJ/bit 12.8 Gb/s Parallel Interface for Die-to-Die Link Applications
Chang, Po-Hao, Chung, Chih-Lun, Hsu, Ying-Yu, Chiang, Chen-Feng
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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