by Key Chung, C., Zhu, Z. X., Kao, C. R.
Published in Journal of electronic materials (01.02.2015)

by Chung, C. Key, Chen, Y.J., Li, C.C., Kao, C.R.
Published in Thin solid films (01.06.2012)

by Chung, C. Key, Chen, Y. J., Yang, T. L., Kao, C. R.
Published in Journal of electronic materials (01.06.2013)

by Key Chung, C., Huang, T.C., Shia, R., Yang, T.L., Kao, C.R.
Published in Journal of alloys and compounds (25.10.2012)

by Chung, C. Key, Duh, Jenq-Gong, Kao, C.R.
Published in Scripta materialia (01.07.2010)

by Lung Huang, Yu, Key Chung, C., Lin, C. F., Hua LU, Guan, Hung Tseng, Ching, Da Chang, Hong, Hsun Hsu, Chih, Xu, Bruce
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)

by Zhuang, Jiaming, Li, Shangxuan, Zhang, Xc, Chen, Ivan, Chen, Bruce, Hsieh, Simon, Yang, Bohan, Chung, C. Key, Xia, Xin
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)

by Refai-Ahmed, Gamal, Wang, Huayan, Ramalingam, Suresh, Karunakaran, Nagadeven, Pan, Ke, Park, SB, Soundarajan, Alegesen, Kanaran, Sreedharan Kelappen, Chung, C. Key, Huang, Yu Lung
Published in 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) (02.12.2020)

by Wang, Xuan, Chung, C. Key
Published in Microelectronics and reliability (01.10.2016)

by Wen Shan Tsai, Huang, C. Y., Chung, C. Key, Yu, K. H., Lin, C. F.
Published in 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2017)

by Hsueh, Yu-Ting, Chang, Hong-Da, Tseng, Wallace, Lin, C. F., Key Chung, C.
Published in 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2018)

by Tsai, Wen Shan, Hsu, Bruce, Chang, Fred, Huang, Yun Long, Lin, Joe, Lin, C. F., Key Chung, C.
Published in 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2018)

by Chung, C. Key, Chen, Y.J., Chen, W.M., Kao, C.R.
Published in Acta materialia (01.06.2012)

by Chung, C. Key, Duh, Jenq-Gong, Kao, C.R.
Published in Scripta materialia (2010)

by Key Chung, C., Aspandiar, R., Foo Leong, K., Cheng Siew Tay
Published in 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) (2002)

by Chung, C. Key, Liu, Luke, Cai, Wuhong, Zhuang, Jiaming, Li, Shangxuan, Shi, Peipei
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)

by Xiang, Min, Ma, Li, Li, Honglei, Jiang, Wei, Chung, C. Key
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10.08.2022)

by Lin, Joe, Chung, C. Key, Lin, C. F., Liao, Ally, Lu, Ying Ju, Shuang Chen, Jia, Ng, Daniel
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)

by You, JinWei, Li, Jay, Ho, David, Li, Jackson, Zhuang, Ming Han, Lai, David, Chung, C. Key, Wang, Yu-Po
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)

by Huang, Yu Lung, Chung, C. Key, Lin, C.F., Yu, Kuo Haw, Lin, Rung Jeng, Hong, Wilson
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)