Improvement of the crystallinity of electroplated copper thin films for highly reliable 3D interconnections
Chuanhong Fan, Asai, Osamu, Furuya, Ryosuke, Suzuki, Ken, Miura, Hideo
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
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Conference Proceeding
Effect of the lattice mismatch between copper thin-film interconnection and base material on the crystallinity of the interconnection
Chuanhong Fan, Asai, O., Suzuki, K., Miura, H.
Published in 2012 14th International Conference on Electronic Materials and Packaging (EMAP) (01.12.2012)
Published in 2012 14th International Conference on Electronic Materials and Packaging (EMAP) (01.12.2012)
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Conference Proceeding
Improvement of the reliability of TSV interconnections by controlling the crystallinity of electroplated copper thin films
Furuya, Ryosuke, Chuanhong Fan, Asai, Osamu, Suzuki, Ken, Miura, Hideo
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding