28nm CPI (Chip/Package Interactions) in Large Size eWLB (Embedded Wafer Level BGA) Fan-Out Wafer Level Packages
Kang Chen, Chua, Linda, Won Kyung Choi, Seng Guan Chow, Seung Wook Yoon
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
Board level reliability improvement in eWLB (embedded wafer level BGA) packages
Seng Guan Chow, Yaojian Lin, Adams, Bernard, Seung Wook Yoon
Published in 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2016)
Published in 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2016)
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Conference Proceeding
Design considerations on solder joint reliability of dual row quad flat no-lead packages
Ming Ying, Seng Guan Chow, Punzalan, J.D., Emigh, R., Ramakrishna, K.
Published in Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) (2004)
Published in Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) (2004)
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Conference Proceeding
Board level solder joint reliability modeling of Embedded Wafer Level BGA (eWLB) packages under temperature cycling test conditions
Seng Guan Chow, Won Kyoung Choi, Emigh, R., Ouyang, E.
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
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Conference Proceeding
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACKING INTERCONNECT AND METHOD OF MANUFACTURE THEREOF
HUANG RUI, CHI, HEE JO, KUAN HEAP HOE, CHO, NAM JU, SHIN, HAN GIL, CHOW SENG GUAN
Year of Publication 22.06.2011
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Year of Publication 22.06.2011
Patent
Study of Board Level Reliability of eWLB (embedded Wafer Level BGA) for 0.35mm Ball Pitch
Lee, Kang Hai, Lim, Yeow Kheng, Chow, Seng Guan, Chen, Kang, Choi, Won Kyung, Yoon, Seung Wook, Liu, N.W., Chi, Yenyao, Lin, Benson
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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Conference Proceeding