Microelectrode Array Biochip: Tool for In Vitro Drug Screening Based on the Detection of a Drug Effect on Dopamine Release from PC12 Cells
Cui, Hui-Fang, Ye, Jian-Shan, Chen, Yu, Chong, Ser-Choong, Sheu, Fwu-Shan
Published in Analytical chemistry (Washington) (15.09.2006)
Published in Analytical chemistry (Washington) (15.09.2006)
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Journal Article
A Fast, Sensitive and Label Free Electrochemical DNA Sensor
Chen, Yu, Elling, Lee, Yoke-ling, Chong, Ser-choong
Published in Journal of physics. Conference series (01.04.2006)
Published in Journal of physics. Conference series (01.04.2006)
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Journal Article
Development of a Cu/Low- k Stack Die Fine Pitch Ball Grid Array (FBGA) Package for System in Package Applications
Xiaowu Zhang, Lau, J H, Premachandran, C S, Ser-Choong Chong, Leong Ching Wai, Lee, V, Chai, T C, Kripesh, V, Sekhar, V N, Pinjala, D, Che, F X
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2011)
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Journal Article
Significantly retarded interfacial reaction between an electroless Ni–W–P metallization and lead-free Sn–3.5Ag solder
Yang, Ying, Balaraju, J.N., Chong, Ser Choong, Xu, Hui, Liu, Changqing, Silberschmidt, Vadim V., Chen, Zhong
Published in Journal of alloys and compounds (15.07.2013)
Published in Journal of alloys and compounds (15.07.2013)
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Journal Article
3D System-on-Packaging Using Through Silicon Via on SOI for High-Speed Optcal Interconnections with Silicon Photonics Devices for Application of 400 Gbps and Beyond
Kim, Do-Won, Yu, Li Hong, Chang, Ka Fai, Woon Leng, Loh, Ser Choong, Chong, Hong, Cai, Bhattacharya, Surya
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
Electrochemical Biochip for Drug Screening At Cellular Level
Chen, Yu, Cui, Hui-fang, Ye, Jian-shan, Chong, Ser-choong, Lim, Tit-meng, Sheu, Fwu-shan, Hui, Wing-cheong
Published in Journal of physics. Conference series (01.04.2006)
Published in Journal of physics. Conference series (01.04.2006)
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Journal Article
Ultra-Thin FO Package-on-Package for Mobile Application
Hsiao, Hsiang-Yao, Ho, Soon Wee, Lim, Simon Siak Boon, Wai, Leong Ching, Chong, Ser Choong, Sharon Lim, Pei Siang, Han, Yong, Chai, Tai Chong
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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Conference Proceeding
Fast Location of Opens in TSV-Based 3-D Chip Using Simple Resistor Chain
Sanming Hu, Cheng Jin, Hongyu Li, Rui Li, Ser Choong Chong, Ming Chinq Jong, Wai, Eva Leong Ching, Keng Hwa Teo, Minkyu Je, Lo, Patrick Guo Qiang
Published in IEEE transactions on electron devices (01.07.2014)
Published in IEEE transactions on electron devices (01.07.2014)
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Journal Article
Comprehensive Study on the Interactions of Multiple Die Shift Mechanisms During Wafer Level Molding of Multichip-Embedded Wafer Level Packages
Ho Siow Ling, Bu Lin, Chong Ser Choong, Velez, Sorono Dexter, Chai Tai Chong, Xiaowu Zhang
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.06.2014)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.06.2014)
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Journal Article
Heterogeneous Three-Layer TSV Chip Stacking Assembly With Moldable Underfill
Pei-Siang, Sharon Lim, Fa Xing Che, Chong Ser Choong, Rong, Michelle Chew Bi, Sekhar, Vasarla Nagendra, Rao, Vempati Srinivasa, Chai Tai Chong
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2013)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2013)
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Journal Article
Fabrication of patterned and non-patterned metallic nanowire arrays on silicon substrate
Sharma, Gaurav, Chong, Ser Choong, Ebin, Liao, Hui, Cai, Gan, Chee Lip, Kripesh, Vaidyanathan
Published in Thin solid films (26.02.2007)
Published in Thin solid films (26.02.2007)
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Journal Article
Fabrication and Testing of a Wafer-Level Vacuum Package for MEMS Device
Premachandran, C. S., Chong, Ser Choong, Liw, Saxon, Nagarajan, Ranganathan
Published in IEEE transactions on advanced packaging (01.05.2009)
Published in IEEE transactions on advanced packaging (01.05.2009)
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Journal Article
In situ temporal detection of dopamine exocytosis from l-dopa-incubated MN9D cells using microelectrode array-integrated biochip
Cui, Hui-Fang, Ye, Jian-Shan, Chen, Yu, Chong, Ser-Choong, Liu, Xiao, Lim, Tit-Meng, Sheu, Fwu-Shan
Published in Sensors and actuators. B, Chemical (26.06.2006)
Published in Sensors and actuators. B, Chemical (26.06.2006)
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Journal Article
Efficient and Adaptive Semantic Segmentation of HBMs using Incremental Learning
Chang, Richard, Thakur, Namrata, Wang, Jie, Li, Yurni, Chong, Ser Choong, Singh Pahwa, Ramanpreet
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Development of Flip-Chip Packaging for Monolithic Microwave Integrated Circuit
Wai, Leong Ching, Guan Lim, Teck, Chong, Ser Choong, Zhou, Lin
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Development of Chip to Wafer Assembly with CuSnAg Microbump on Solder on Pad Interposer using Thermocompression and Solder Reflow
Keng Yuen, Jason Au, Chong, Ser Choong, Daniel, Ismael Cereno
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Development of a Disposable Bio-Microfluidic Package With Reagents Self-Contained Reservoirs and Micro-Valves for a DNA Lab-on-a-Chip (LOC) Application
Ling Xie, Premachandran, C.S., Chew, M., Ser Choong Chong
Published in IEEE transactions on advanced packaging (01.05.2009)
Published in IEEE transactions on advanced packaging (01.05.2009)
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Journal Article
Cu Damascene Process on Temporary Bonded Wafers for Thin Chip Stacking using Cu-Cu Hybrid Bonding
Sekhar, Vasarla Nagendra, Kumar, Mishra Dileep, Lianto, Prayudi, Chong, Ser Choong, Rao, Vempati Srinivasa
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
Process Challenges in Thin Wafers Fabrication with Double Side Hybrid Bond Pads for Chip Stacking
Kumar, Mishra Dileep, Nagendra Sekhar, Vasarla, Rao, B.S.S. Chandra, Choong Chong, Ser, Rao, Vempati Srinivasa
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Multi-Chip Stacked Memory Module Development using Chip to Wafer (C2W) Hybrid Bonding for Heterogeneous Integration Applications
Sekhar, Vasarla Nagendra, Kumar, Mishra Dileep, Tippabhotla, Sasi Kumar, Rao, B. S. S. Chandra, Daniel, Ismael Cereno, Chong, Ser Choong, Rao, Vempati Srinivasa
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding