Paddle tilt towards Paddle Flash performance on small outline package
Ting, Kow Siew, Jia Yunn, Ting, Yahaya, Khairul Ikhsan, Choo Tian, Ooi
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
MOLDED SENSOR PACKAGE WITH AN INTEGRATED MAGNET AND METHOD OF MANUFACTURING THE SAME
MOHD HIRZARUL HAFIZ MOHD TAHIR, CHEW THENG TAI, KLAUS ELIAN, CHOO TIAN OOI
Year of Publication 27.01.2016
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Year of Publication 27.01.2016
Patent