Numerical Analysis of the Thermal and Mechanical Performance of Cu Pillar Bumps During Reflow: Effects of Height and Solder Material
Lee, Jing Rou, Chong, Mun Xi, Abdul Aziz, Mohd Sharizal, Khor, Chu Yee, Mohd Salleh, Mohd Arif Anuar, Mohd Arif Zainol, Mohd Remy Rozainy, Ani, F. Che
Published in Journal of electronic materials (01.03.2024)
Published in Journal of electronic materials (01.03.2024)
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