Three dimensional computerized tomography X-ray technique for package level analysis
Lai-Seng Yeoh, Too-Ki Lim, Kok-Cheng Chong, Li, Susan
Published in 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2017)
Published in 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2017)
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Conference Proceeding
Failure analysis for probe mark induced galvanic corrosion and bond degradation during HAST
Lai-Seng Yeoh, Kok-Cheng Chong, Li, Susan
Published in Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2013)
Published in Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2013)
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Conference Proceeding
Comparative study on delineation of Cu-Al intermetallic using chemical treatment and ion milling
Lai-Seng Yeoh, Kok-Cheng Chong, Li, Susan
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
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Conference Proceeding
Comparative study on sample preparation techniques for Cu-Al interfacial analysis
Lai-Seng Yeoh, del Rosario, Amalia, Chee-Wah Tam, Kok-Cheng Chong, Li, Susan, Adem, Ercan, Tracy, Bryan
Published in 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.06.2015)
Published in 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.06.2015)
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Conference Proceeding
Advanced EDX Analysis for Memory Devices
Yeoh, Lai-Seng, Chong, Kok-Cheng, Li, Susan, Kaeppel, Andi
Published in 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (20.07.2020)
Published in 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (20.07.2020)
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Conference Proceeding
Thermal ions diffusion on printed circuit board
Lai-Seng Yeoh, Kok-Cheng Chong, Li, Susan
Published in Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01.06.2014)
Published in Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01.06.2014)
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Conference Proceeding
Case studies of laser ablation effects on Flash Memory devices
Yeoh Lai Seng, Yeoh Joon Chai, Chong Kok Cheng, Li, S.
Published in 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.07.2012)
Published in 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.07.2012)
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Conference Proceeding
EBIC Application in Finding Particle Defects
Yeoh, Lai-Seng, Chong, Kok-Cheng, Li, Susan
Published in 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (18.07.2022)
Published in 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (18.07.2022)
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Conference Proceeding
Finding Invisible Cracks via Nano-Probing
Yeoh, Lai-Seng, Chong, Kok-Cheng, Li, Susan, Rummel, Andreas
Published in 2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (15.09.2021)
Published in 2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (15.09.2021)
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