Die Pad Delamination on QFN Package
Chiew, Chong Chee, Samsun, Paing, Vigneswaran, Letcheemana, Ang, Amy
Published in 2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) (01.09.2018)
Published in 2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) (01.09.2018)
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Conference Proceeding
Subtractive Metal Structuring on Surface of Semiconductor Package
Lee, Chee Hong, Pok, Pei Luan, Lee, Swee Kah, Chong, Chee Chiew, Paing, Samsun, Goh, Soon Lock
Year of Publication 19.09.2024
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Year of Publication 19.09.2024
Patent
Effect of Lead Frame and Mold Tool Dimension and Tolerance on Lead Burr in Cavity Encapsulation
Regua, Clemen Jose Abrena, Chee, Lee Chai, Chiew, Chong Chee, Boon, Tay Wee
Published in 2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) (01.09.2018)
Published in 2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) (01.09.2018)
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Conference Proceeding
Topside-cooled semiconductor package with molded standoff
Chong, Chee Chiew, Lim, Wee Aun Jason, Chen, Liu, Tay, Wee Boon, Myers, Edward
Year of Publication 01.02.2022
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Year of Publication 01.02.2022
Patent
TOPSIDE-COOLED SEMICONDUCTOR PACKAGE WITH MOLDED STANDOFF
MYERS, Edward, CHONG, Chee Chiew, TAY, Wee Boon, LIM, Wee Aun Jason, CHEN, Liu
Year of Publication 23.12.2021
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Year of Publication 23.12.2021
Patent
Incomplete fill for FlipChip design in MAP mold package
Chiew, Chong Chee, How, Chong Meng, Asentista, Calo Paularmand, Sidik, Norsuhaili Mohd
Published in 36th International Electronics Manufacturing Technology Conference (01.11.2014)
Published in 36th International Electronics Manufacturing Technology Conference (01.11.2014)
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Conference Proceeding
Subtraktives Metallstrukturieren auf der Oberfläche eines Halbleiterpackages
Lee, Chee Hong, Pok, Pei Luan, Lee, Swee Kah, Chong, Chee Chiew, Paing, Samsun, Goh, Soon Lock
Year of Publication 19.09.2024
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Year of Publication 19.09.2024
Patent
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
AROKIASAMY XAVIER, TAY WEE-BOON, CHIANG CHAU FATT, LEE CHEE HONG, CHONG CHEE CHIEW, GOA JOO MING, CHELLAMUTHU NAVEENDRAN, CHEN STEVEN, MUHAMMAD MUHAMMAT SANUSI
Year of Publication 12.10.2021
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Year of Publication 12.10.2021
Patent
HALBLEITERGEHÄUSE UND VERFAHREN ZU SEINER HERSTELLUNG
Lee, Chee Hong, Arokiasamy, Xavier, Chong, Chee Chiew, Chiang, Chau Fatt, Chellamuthu, Naveendran, Muhammad, Muhammat Sanusi, Goa, Joo Ming, Tay, Wee Boon, Tan, Chee Voon
Year of Publication 07.10.2021
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Year of Publication 07.10.2021
Patent