Effects of conditioning temperature on polishing pad for oxide chemical mechanical polishing process
Kim, Nam-Hoon, Choi, Gwon-Woo, Park, Jin-Seong, Seo, Yong-Jin, Lee, Woo-Sun
Published in Microelectronic engineering (01.12.2005)
Published in Microelectronic engineering (01.12.2005)
Get full text
Journal Article
Conference Proceeding
Chemical mechanical polishing (CMP) mechanisms of thermal SiO2 film after high-temperature pad conditioning
KIM, Nam-Hoon, KO, Pil-Ju, CHOI, Gwon-Woo, SEO, Yong-Jin, LEE, Woo-Sun
Published in Thin solid films (10.05.2006)
Published in Thin solid films (10.05.2006)
Get full text
Conference Proceeding
Journal Article
CMP characteristics and optical property of ITO thin film by using silica slurry with a variety of process parameters
Choi, Gwon-Woo, Lee, Kang-Yeon, Kim, Nam-Hoon, Park, Jin-Seong, Seo, Yong-Jin, Lee, Woo-Sun
Published in Microelectronic engineering (01.11.2006)
Published in Microelectronic engineering (01.11.2006)
Get full text
Journal Article
Conference Proceeding
APPARATUS FOR CONDITIONING A POLISHING PAD
LEE, YOUNG KYUN, SEO, YONG JIN, CHOI, GWON WOO, HAN, SANG JUN, PARK, SUNG WOO, LEE, WOO SUN
Year of Publication 18.05.2009
Get full text
Year of Publication 18.05.2009
Patent