Effects of minor additions of Zn on interfacial reactions of Sn-Ag-Cu and Sn-Cu solders with various Cu substrates during thermal aging
MOON GI CHO, KANG, Sung K, SHIH, Da-Yuan, HYUCK MO LEE
Published in Journal of electronic materials (01.11.2007)
Published in Journal of electronic materials (01.11.2007)
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